Touch detecting unit capable of proximity sensing and display device including the same

ABSTRACT

A touch detecting unit comprises first sensor electrodes arranged in a first direction and electrically connected with one another second sensor electrodes arranged in a second direction crossing the first direction, and electrically connected with one another, the second sensor electrodes electrically separated from the first sensor electrodes, and third sensor electrodes electrically separated from the first sensor electrodes and the second sensor electrodes. Amounts of change in first capacitances between the first sensor electrodes and the second sensor electrodes are detected in a first mode. Amounts of change in the first capacitances and amounts of change in a second capacitance between the first sensor electrodes and the third sensor electrodes are detected in a second mode.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Korean Patent Application No.10-2019-0079184 filed on Jul. 2, 2019, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field of the Disclosure

The disclosure relates to a touch detecting unit and a display deviceincluding the same.

2. Description of the Related Art

As the information-oriented society evolves, various demands for displaydevices are ever increasing. For example, display devices are beingemployed by a variety of electronic devices such as smart phones,digital cameras, laptop computers, navigation devices, and smarttelevisions.

As display devices are employed by various electronic devices, displaydevices are required to have various designs. Recently, bezeless smartphones have been developed that minimize bezel width. The bezel refersto a non-display area disposed around the display area where an image isdisplayed.

In the bezel of a smart phone, a proximity sensor for detecting whethera user is located in front of the display device is generally disposed.Therefore, it is necessary to eliminate the proximity sensor in order tominimize the bezel width of a smart phone.

SUMMARY

Embodiments of the present disclosure are to provide a touch detectingunit capable of proximity sensing.

Embodiments of the present disclosure are also to provide a displaydevice including touch detecting unit capable of proximity sensing.

According to an embodiment of the disclosure, a touch detecting unitcomprises: first sensor electrodes arranged in a first direction andelectrically connected with one another; second sensor electrodesarranged in a second direction crossing the first direction, andelectrically connected with one another, the second sensor electrodeselectrically separated from the first sensor electrodes; and thirdsensor electrodes electrically separated from the first sensorelectrodes and the second sensor electrodes. Amounts of change in firstcapacitances between the first sensor electrodes and the second sensorelectrodes are detected in a first mode. Amounts of change in the firstcapacitances and amounts of change in a second capacitance between thefirst sensor electrodes and the third sensor electrodes are detected ina second mode.

According to an embodiment of the disclosure, a touch detecting unitcomprises: first sensor electrodes arranged in a first direction andelectrically connected with one another; second sensor electrodesarranged in a second direction crossing the first direction, andelectrically connected with one another, and the second sensorelectrodes electrically separated from the first sensor electrodes; andthird sensor electrodes electrically separated from the first sensorelectrodes and the second sensor electrodes. Values of firstcapacitances between the first sensor electrodes and the second sensorelectrodes are detected in a first mode. The values of the firstcapacitances and values of second capacitances between the second sensorelectrodes and the third sensor electrodes are detected in a secondmode.

According to an embodiment of the disclosure, a touch detecting unitcomprises: first sensor electrodes arranged in a first direction andelectrically connected with one another; second sensor electrodesarranged in a second direction crossing the first direction,electrically connected with one another and electrically separated fromthe first sensor electrodes; third sensor electrodes electricallyseparated from the first sensor electrodes and the second sensorelectrodes; fourth sensor electrodes electrically separated from thefirst sensor electrodes and the second sensor electrodes. Amounts ofchange in first capacitances between the first sensor electrodes and thesecond sensor electrodes are detected in a first mode. The amounts ofchange in the first capacitances, amounts of change in a secondcapacitance between the first sensor electrodes and the third sensorelectrodes, and amounts of change in a third capacitance between thefirst sensor electrodes and the fourth sensor electrodes are detected ina second mode.

According to an embodiment of the disclosure, by detecting the amountsof change in first mutual capacitances and the amounts of change insecond mutual capacitances in a first area, it is possible to determinewhether a person or an object is proximate thereto. This allows thedisplay device to detect the proximity of a person or an object withoutany proximity sensor, and thus it is possible to reduce the bezel widthof the display device on which otherwise the proximity sensor isdisposed.

It should be noted that effects of the present disclosure are notlimited to those described above and other effects of the presentdisclosure will be apparent to those skilled in the art from thefollowing descriptions.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present disclosure will become moreapparent by describing in detail example embodiments thereof withreference to the accompanying drawings, in which:

FIG. 1 is a perspective view of a display device according to an exampleembodiment of the current disclosure;

FIG. 2 is a plan view showing a display device according to an exampleembodiment of the current disclosure;

FIGS. 3 and 4 are side views showing a display device according to anexample embodiment of the current disclosure;

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 2;

FIG. 6 is a plan view showing the display unit of FIG. 5 and relatedelements;

FIG. 7 is a plan view showing the touch detecting unit of FIG. 5 and therelated elements;

FIG. 8 is an example of a method of detecting the amount of change in afirst mutual capacitance and the amount of change in a second mutualcapacitance in the first area of FIG. 7;

FIG. 9 is an example of a method of detecting the amount of change in afirst mutual capacitance in the second area of FIG. 7;

FIG. 10 is an enlarged plan view showing an example of area A of FIG. 7;

FIG. 11 is an enlarged plan view showing an example of area B of FIG. 7;

FIGS. 12A and 12B are enlarged plan views showing areas A-1 and A-2 ofFIG. 10, respectively;

FIGS. 13A and 13B are enlarged plan views showing areas B-1 and B-2 ofFIG. 11, respectively;

FIG. 14 is a cross-sectional view showing an example, taken along lineII-II′ of FIG. 12A;

FIG. 15 is an enlarged plan view showing an example of area A of FIG. 7;

FIG. 16 is an enlarged plan view showing an example of area B of FIG. 7;

FIGS. 17A and 17B are enlarged plan views showing areas A-1 and A-2 ofFIG. 15, respectively;

FIGS. 18A and 18B are enlarged plan views showing areas B-1 and B-2 ofFIG. 16, respectively;

FIG. 19 is an enlarged plan view showing an example of area A of FIG. 7;

FIGS. 20A and 20B are enlarged plan views showing areas A-1 and A-2 ofFIG. 19, respectively;

FIG. 21 is a plan view showing the touch detecting unit of FIG. 5 andthe related elements;

FIG. 22 is an enlarged plan view showing an example of area A of FIG.21;

FIG. 23 is an enlarged plan view showing an example of area B of FIG.21;

FIGS. 24A and 24B are enlarged plan views showing areas A-1 and A-2 ofFIG. 22, respectively;

FIGS. 25A and 25B are enlarged plan views showing areas B-1 and B-2 ofFIG. 23, respectively;

FIG. 26 is an enlarged plan view showing an example of area A of FIG.21;

FIG. 27 is an enlarged plan view showing an example of area B of FIG.21;

FIGS. 28A and 28B are enlarged plan views showing areas A-1 and A-2 ofFIG. 26, respectively;

FIGS. 29A and 29B are enlarged plan views showing areas B-1 and B-2 ofFIG. 27, respectively;

FIG. 30 is an enlarged plan view showing an example of area A of FIG. 7;

FIGS. 31A and 31B are enlarged plan views showing areas A-1 and A-2 ofFIG. 30, respectively;

FIG. 32 is a plan view showing the touch detecting unit of FIG. 5 andthe related elements;

FIG. 33 shows an example of a method for detecting the amount of changein a first mutual capacitance, and the amount of change in a secondmutual capacitance and the amount of change in a third mutualcapacitance in the first area of FIG. 32;

FIG. 34 is an enlarged plan view showing an example of area A of FIG.32; and

FIGS. 35A and 35B are enlarged plan views showing areas A-1 and A-2 ofFIG. 34, respectively;

DETAILED DESCRIPTION OF THE EMBODIMENTS

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. Like reference numerals refer tolike elements throughout.

It will also be understood that when a layer is referred to as being“on” another layer or substrate, it can be directly on the other layeror substrate, or intervening layers may also be present. In contrast,when an element is referred to as being “directly on” another element,there are no intervening elements present.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” “At least one of A and B” means “Aand/or B.” As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. It will befurther understood that the terms “comprises” and/or “comprising,” or“includes” and/or “including” when used in this specification, specifythe presence of stated features, regions, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, regions, integers, steps,operations, elements, components, and/or groups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother elements as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The example term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The example terms “below” or “beneath” can,therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system).

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thedisclosure, and will not be interpreted in an idealized or overly formalsense unless expressly so defined herein.

Example embodiments are described herein with reference to cross sectionillustrations that are schematic illustrations of idealized embodiments.As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments described herein should not be construed aslimited to the particular shapes of regions as illustrated herein butare to include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a display device according to an exampleembodiment of the present disclosure. FIG. 2 is a plan view of a displaydevice according to an example embodiment of the present disclosure.FIGS. 3 and 4 are side views showing a display device according to anexample embodiment of the present disclosure.

As used herein, the terms “above,” “top” and “upper surface” refer tothe upper side of the display panel 100, i.e., the side indicated by thearrow in the z-axis direction, whereas the terms “below,” “bottom” and“lower surface” refer to the lower side of the display panel 100, i.e.,the opposite side in the z-axis direction. As used herein, the terms“left,” “right,” “upper” and “lower” sides indicate relative positionswhen the display panel 100 is viewed from the top. For example, the“left side” refers to the opposite direction indicated by the arrow ofthe x-axis, the “right side” refers to the direction indicated by thearrow of the x-axis, the “upper side” refers to the direction indicatedby the arrow of the y-axis, and the “lower side” refers to the oppositedirection indicated by the arrow of the y-axis.

Referring to FIGS. 1 to 2, a display device 10 is for displaying movingimages or still images. The display device 1 may be used as the displayscreen of portable electronic devices such as a mobile phone, a smartphone, a tablet PC, a smart watch, a watch phone, a mobilecommunications terminal, an electronic notebook, an electronic book, aportable multimedia player (PMP), a navigation device and an ultramobile PC (UMPC), as well as the display screen of various products suchas a television, a notebook, a monitor, a billboard and the Internet ofThings. The display device 10 may be one of an organic light-emittingdisplay device, a liquid-crystal display device, a plasma displaydevice, a field emission display device, an electrophoretic displaydevice, an electrowetting display device, a quantum dot light-emittingdisplay device, a micro LED display device and the like. In thefollowing description, an organic light-emitting display device isdescribed as an example of the display device 10. It is, however, to beunderstood that the present disclosure is not limited thereto.

According to an example embodiment of the present disclosure, a displaydevice 10 includes a display panel 100, a display driving circuit 200, acircuit board 300 and a touch driving circuit 400.

The display panel 100 may include a main area MA and a protruding areaPA protruding from one side of the main area MA.

The main area MA may be formed in a rectangular plane having short sidesin a first direction (x-axis direction) and long sides in a seconddirection (y-axis direction) intersecting the first direction (x-axisdirection). Each of the corners where the short side in the firstdirection (x-axis direction) meets the long side in the second direction(y-axis direction) may be rounded with a predetermined curvature or maybe a right angle. The shape of the display device 10 when viewed fromthe top is not limited to a quadrangular shape, but may be formed inanother polygonal shape, circular shape, or elliptical shape. The mainarea MA may be, but is not limited to being, formed to be flat. The mainarea MA 10 may include curved portions formed at left and right endsthereof. The curved portions may have a constant curvature or varyingcurvatures.

The main area MA may include a display area DA where pixels PX areformed to display images, and a non-display area NDA around the displayarea DA.

In addition to the pixels, scan lines, data lines, and power linesconnected to the pixels may be disposed in the display area DA. When themain area MA includes a curved portion, the display area DA may bedisposed on the curved portion. In such case, the image of the displaypanel 100 can also be seen on the curved portion.

The non-display area NDA may be defined as the area from the outside ofthe display area DA to the edge of the display panel 100. In thenon-display area NDA, a scan driver for applying scan signals to scanlines, and link lines connecting the data lines with the display drivingcircuit 200 may be disposed.

The protruding area PA may protrude from one side of the main area MA.For example, the protruding area PA may protrude from the lower side ofthe main area MA as shown in FIG. 2. The length of the protruding areaPA in the first direction (x-axis direction) may be smaller than thelength of the main area MA in the first direction (x-axis direction).

The protruding area PA may include a bending area BA and a pad area PDA.In such case, the pad area PDA may be disposed on one side of thebending area BA, and the main area MA may be disposed on the oppositeside of the bending area BA. For example, the pad area PDA may bedisposed on the lower side of the bending area BA, and the main area MAmay be disposed on the upper side of the bending area BA.

The display panel 100 may be formed to be flexible so that it can becurved, bent, folded or rolled. Therefore, the display panel 100 may bebent at the bending area BA in the thickness direction. As shown in FIG.3, one surface of the pad area PDA of the display panel 100 upwardlyfaces before the display panel 100 is bent. As shown in FIG. 4, thesurface of the pad area PDA of the display panel 100 downwardly facesafter the display panel 100 is bent. As a result, since the pad area PDAis disposed under the main area MA, it may overlap the main area MA.

Pads electrically connected to the display driving circuit 200 and thecircuit board 300 may be disposed in the pad area PDA of the displaypanel 100.

A panel cover member 101 may be disposed under the display panel 100.The panel cover member 101 may be attached to the lower surface of thedisplay panel 100 by an adhesive member. The adhesive member may be apressure-sensitive adhesive (PSA).

The panel cover member 101 may include: a light-absorbing member forabsorbing light incident from outside, a buffer member for absorbingexternal impact, and a heat dissipating member for efficientlydischarging heat from the display panel 100.

The light-absorbing member may be disposed under the display panel 100.The light-absorbing member blocks the transmission of light to preventthe elements disposed thereunder from being seen from above the displaypanel 100, such as the display circuit board 310. The light-absorbingmember may include a light-absorbing material such as a black pigmentand a black dye.

The buffer member may be disposed under the light-absorbing member. Thebuffer member absorbs an external impact to prevent the display panel100 from being damaged. The buffer member may be made up of a singlelayer or multiple layers. For example, the buffer member may be formedof a polymer resin such as polyurethane, polycarbonate, polypropyleneand polyethylene, or may be formed of a material having elasticity suchas a rubber and a sponge obtained by foaming a urethane-based materialor an acrylic-based material. The buffer member may be a cushion layer.

The heat dissipating member may be disposed under the buffer member. Theheat dissipation member may include a first heat dissipation layerincluding graphite or carbon nanotubes, and a second heat dissipationlayer formed of a thin metal film such as copper, nickel, ferrite andsilver, which can block electromagnetic waves and have high thermalconductivity.

In order to allow the display panel 100 to be easily bent, the panelcover member 101 may not be disposed in the bending area BA of thedisplay panel 100 as shown in FIG. 3. Since the display panel 100 isbent in the bending area BA such that the pad area PDA is disposed underthe main area MA, the display panel 100 may overlap the main area MA.Accordingly, the panel cover member 101 disposed in the main area MA ofthe display panel 100 and the panel cover member 101 disposed in the padarea PDA of the display panel 100 may be attached together by anadhesive member 102. The adhesive member 102 may be a pressure-sensitiveadhesive.

The display driving circuit 200 outputs signals and voltages for drivingthe display panel 100. For example, the display driving circuit 200 mayapply data voltages to the data lines. In addition, the display drivingcircuit 200 may apply supply voltage to the power line and may applyscan control signals to the scan driver. The display driving circuit 200may be implemented as an integrated circuit (IC) and may be attached tothe display panel 100 in a pad area PDA by a chip on glass (COG)technique, a chip on plastic (COP) technique, or an ultrasonic bonding.For example, the display driving circuit 200 may be mounted on thecircuit board 300.

The pads may include display pads electrically connected to the displaydriving circuit 200 and touch pads electrically connected to touchlines.

The circuit board 300 may be attached to the pads using an anisotropicconductive film. In this manner, the lead lines of the circuit board 300may be electrically connected to the pads. The circuit board 300 may bea flexible printed circuit board, a printed circuit board, or a flexiblefilm such as a chip on film.

The touch driving circuit 400 may be connected to the sensor electrodesof the touch sensing layer TSL of the display panel 100. The touchdriving circuit 400 applies driving signals to the sensor electrodes ofthe touch sensing layer TSL and measures mutual capacitances of thesensor electrodes. The driving signals may have driving pulses. Thetouch driving circuit 400 can determine whether a user has touched orhas presented based on the mutual capacitances. A user's touch meansthat an object such as the user's finger or a pen is brought intocontact with a surface of the display device 10 disposed on the touchsensing layer TSL. The user's proximity touch means that an object suchas the user's finger or a pen is hovering over a surface of the displaydevice 10.

The touch driving circuit 400 may be disposed on the circuit board 300.The touch driving circuit 400 may be implemented as an integratedcircuit (IC) and may be mounted on the circuit board 300.

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 2.

Referring to FIG. 5, the display device 100 may include a display unitDU having a substrate SUB, a thin-film transistor layer TFTL disposed onthe substrate SUB, an emission material layer EML and a thin-filmencapsulation layer TFEL; and a touch detecting unit TDU having a touchsensing layer TSL.

The substrate SUB may be made of an insulating material such as glass,quartz and a polymer resin. Examples of the polymer material may includepolyethersulphone (PES), polyacrylate (PA), polyacrylate (PAR),polyetherimide (PEI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide(PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetatepropionate (CAP) or a combination thereof. Alternatively, the substrateSUB may include a metallic material.

The substrate SUB may be a rigid substrate or a flexible substrate thatcan be bent, folded, rolled, and so on. When the substrate SUB is aflexible substrate, it may be formed of, but is not limited to,polyimide (PI).

The thin-film transistor layer TFTL may be disposed on the substrateSUB. On the thin-film transistor layer TFTL, scan lines, data lines,power supply lines, scan control lines, and routing lines connecting thepads with the data lines may be formed as well as thin-film transistorsin the pixels. Each of the thin-film transistors may include a gateelectrode, a semiconductor layer, a source electrode, and a drainelectrode. When the scan driver 110 is formed in the non-display areaNDA of the display panel 100 as shown in FIG. 6, the scan driver 110 mayinclude thin-film transistors.

The thin-film transistor layer TFTL may be disposed in the display areaDA and the non-display area NDA. Specifically, the thin-film transistorsin the pixels, the scan lines, the data lines, and the power supplylines on the thin-film film transistor layer TFTL may be disposed in thedisplay area DA. The scan control lines and the link lines on thethin-film transistor layer TFTL may be disposed in the non-display areaNDA.

The emission material layer EML may be disposed on the thin-filmtransistor layer TFTL. The emission material layer EML may includepixels including a first electrode, an emitting layer, a plurality ofpixel including a second electrode, and a bank. The emitting layer maybe an organic emitting layer containing an organic material. Then, theemitting layer may include a hole transporting layer, an organiclight-emitting layer, and an electron transporting layer. When voltageis applied to the first electrode and cathode voltage is applied to thesecond electrode through the thin-film transistor on the thin-filmtransistor layer TFTL, the holes and electrons move to the organiclight-emitting layer through the hole transporting layer and theelectron transporting layer, respectively, so that they combine in theorganic light-emitting layer to emit light. The pixels on the emissionmaterial layer EML may be disposed in the display area DA.

The thin-film encapsulation layer TFEL may be disposed on the emissionmaterial layer EML. The thin-film encapsulation layer TFEL serves toprevent oxygen or moisture from permeating into the emission materiallayer EML. To this end, the thin-film encapsulation layer TFEL mayinclude at least one inorganic layer. The inorganic layer may be, butnot limited to, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.In addition, the thin-film encapsulation layer TFEL protects theemission material layer EML from foreign substances such as dust. Tothis end, the thin-film encapsulation layer TFEL may include at leastone organic layer. The organic layer may be formed of, but is notlimited to, an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin and a polyimide resin.

The thin-film encapsulation layer TFEL may be disposed in the displayarea DA as well as the non-display area NDA. Specifically, the thin-filmencapsulation layer TFEL may cover the display area DA and the emissionmaterial layer EML, and may cover the thin-film transistor layer TFTL inthe non-display area NDA.

The touch sensing layer TSL may be disposed on the thin-filmencapsulation layer TFEL. As the touch sensing layer TSL is disposeddirectly on the thin-film encapsulation layer TFEL, the thickness of thedisplay device 10 can be reduced, compared with a display device inwhich a separate touch panel including the touch sensing layer TSL isattached on the thin-film encapsulation layer TFEL.

The touch sensing layer TSL may include sensor electrodes for sensing auser's touch by mutual capacitive sensing and touch lines for connectingthe pads with the sensor electrodes. The sensor electrodes of the touchsensing layer TSL may be disposed in a touch sensing area TSAoverlapping the display area DA as shown in FIG. 7. The touch lines ofthe touch sensing layer TSL may be disposed in a touch peripheral areaTPA overlapping the non-display area NDA as shown in FIG. 7.

A polarizing film may be disposed on the touch sensing layer TSL. Thepolarizing film may include a linear polarizer and a phase retardationfilm such as a λ/4 (quarter-wave) plate. In such case, the phaseretardation film may be disposed on the touch sensing layer TSL, and thelinear polarizer may be disposed on the phase retardation film. Inaddition, a cover window may be disposed on the polarizing film. Thecover window may be attached onto the polarizing film by a transparentadhesive member such as an optically clear adhesive (OCA) film.

FIG. 6 is a plan view showing the display unit of FIG. 5 and relatedelements.

For convenience of illustration, FIG. 6 shows only pixels P, scan linesSL, data lines DL, scan control lines SCL, fan-out lines DLL, a scandriver 110, a display driving circuit 200 and display pads DP of thedisplay unit DU.

Referring to FIG. 6, the scan lines SL, the data lines DL, and thepixels P are disposed in the display area DA. The scan lines SL may bearranged in the first direction (x-axis direction), while the data linesDL may be arranged in the second direction (y-axis direction)intersecting the first direction (x-axis direction).

Each of the pixels P may be connected to at least one of the scan linesSL and at least one of the data lines DL. Each of the pixels P mayinclude thin-film transistors including a driving transistor and atleast one switching transistor, a light-emitting element, and acapacitor. When a scan signal is applied from a scan line SL, each ofthe pixels P receives a data voltage from a data line DL and supplies adriving current to the light-emitting element according to the datavoltage applied to the gate electrode, so that light is emitted.Although an organic light-emitting element including an anode electrode,an organic emitting layer, and a cathode electrode has been described asan example of the light-emitting element, the present disclosure is notlimited thereto. The light-emitting element may be implemented as aquantum-dot light-emitting element including an anode electrode, aquantum-dot emitting layer, and a cathode electrode, as an inorganiclight-emitting element including an anode electrode, an inorganicemitting layer having an inorganic semiconductor, and a cathodeelectrode, or as a micro light-emitting element including a microlight-emitting diode. The scan driver 110 is connected to the displaydriving circuit 200 through a plurality of scan control lines SCL.Accordingly, the scan driver 110 may receive the scan control signal ofthe display driver circuit 200. The scan driver 110 generates scansignals according to scan control signal and supplies the scan signalsto the scan lines SL.

Although the scan driver 110 is formed in the non-display area NDA onthe left side of the display area DA in FIG. 5, the present disclosureis not limited thereto. For example, the scan driver 110 may be formedin the non-display area NDA on the left side as well as in thenon-display area NDA on the right side of the display area DA.

The display driving circuit 200 is connected to the display pads DP andreceives digital video data and timing signals. The display drivingcircuit 200 converts the digital video data into analogpositive/negative data voltages and supplies them to the data lines DLthrough the fan-out lines DLL. In addition, the display driving circuit200 generates and supplies scan control signal for controlling the scandriver 110 through the scan control lines SCL. The pixels P to which thedata voltages are supplied are selected by the scan signals of the scandriver 110 and the data voltages are supplied to the selected pixels P.The display driver circuit 200 may be implemented as an integratedcircuit (IC) and may be attached to the substrate SUB by a chip on glass(COG) technique, a chip on plastic (COP) technique, or an ultrasonicbonding. It is, however, to be understood that the present disclosure isnot limited thereto. For example, the display driving circuit 200 may bemounted on the circuit board 300.

As shown in FIG. 6, the display panel 100 may include display pads DPelectrically connected to the display driving circuit 200 and touch padsTP1 and TP2 electrically connected to the touch lines. A display padarea DPA in which the display pads DP are disposed may be disposedbetween a first touch pad area TPA1 in which the first touch pads TP1are disposed and a second touch pad area TPA2 in which the second touchpads TP2 are disposed. As shown in FIG. 6, the display pad area DPA maybe disposed at the center of one end of the protruding area PA, thefirst touch pad area TPA1 may be disposed at the left side of the end ofthe protruding area PA, and the second touch pad area TPA2 may bedisposed on the right side of the end of the protruding area PA.

The circuit board 300 may be attached to the display pads DP and thetouch pads TP1 and TP2 using an anisotropic conductive film.Accordingly, the lead lines of the circuit board 300 may be electricallyconnected to the display pads DP and the touch pads TP1 and TP2. Thecircuit board 300 may be a flexible printed circuit board, a printedcircuit board, or a flexible film such as a chip on film.

The touch driving circuit 400 may be connected to the sensor electrodesof the touch detecting unit of the display panel 100. The touch drivingcircuit 400 applies driving signals to the sensor electrodes andmeasures mutual capacitances of the sensor electrodes. The drivingsignals may have a plurality of driving pulses. The touch drivingcircuit 400 may calculate the coordinates of a touch input according tomutual capacitances.

The touch driving circuit 400 may be disposed on the circuit board 300.The touch driving circuit 400 may be implemented as an integratedcircuit (IC) and may be mounted on the circuit board 300.

FIG. 7 is a plan view showing the touch detecting unit of FIG. 5 and therelated elements.

For convenience of illustration, FIG. 7 shows only sensor electrodes TE,RE and PE, conductive patterns DE, touch lines TL, RL and PL, touch padsTP1 and TP2, guard lines GL1 to GL5, and ground lines GRL1 to GRL3.

Referring to FIG. 7, the touch detecting unit TDU includes a touchsensing area TSA for sensing a user's touch, and a touch peripheral areaTPA disposed around the touch sensing area TSA. The touch sensing areaTSA may overlap the display area DA of the display panel 100, and thetouch peripheral area TPA may overlap the non-display area NDA of thedisplay unit DU.

The touch sensing area TSA includes a first area PA1 for sensing whethera person or an object is proximate thereto, and a second area PA2 otherthan the first area PA1. Although the first area PA1 of the touchsensing area TSA is adjacent to the upper side of the display device 10in the example shown in FIG. 7, the present disclosure is not limitedthereto. The first area PA1 of the touch sensing area TSA may beadjacent to another side of the display device 10 or may be the centerarea of the touch sensing area TSA. In addition, although the first areaPA1 is a part of the touch sensing area TSA in the example shown in FIG.7, the present disclosure is not limited thereto. The touch sensing areaTSA may include only the first area PA1 without the second area PA2.

The sensor electrodes TE, RE and PE may include first sensor electrodesTE, second sensor electrodes RE, and third sensor electrodes PE. In theexample embodiment shown in FIG. 7, the first sensor electrode is thedriving electrode TE, the second sensor electrode is the sensingelectrode RE, and the third sensor electrode is the proximity sensingelectrode PE.

The sensing electrodes RE may be arranged in the first direction (x-axisdirection) and electrically connected to one another. The drivingelectrodes TE may be arranged in the second direction (y-axis direction)crossing the first direction (x-axis direction) and may be electricallyconnected to one another. The proximity sensing electrodes PE arearranged in the second direction (y-axis direction) and may beelectrically connected to one another. Although each of the drivingelectrodes TE, the sensing electrodes RE and the proximity sensingelectrodes PE has a diamond shape when viewed from the top in theexample shown in FIG. 7, the shape of each of the driving electrodes TE,the sensing electrodes RE and the proximity sensing electrodes PE is notlimited thereto.

The driving electrodes TE, the sensing electrodes RE and the proximitysensing electrodes PE may be electrically separated from each other. Thedriving electrodes TE, the sensing electrodes RE and the proximitysensing electrodes PE may be spaced apart from each other. The drivingelectrodes TE and the proximity sensing electrodes PE may be arranged inparallel in the second direction (y-axis direction). The proximitysensing electrodes PE may be surrounded by the driving electrodes TE,respectively. In order to electrically separate the sensing electrodesRE from the driving electrodes TE at their intersections, the drivingelectrodes TE adjacent to each other in the second direction (y-axisdirection) may be connected through the first connection patterns BE1,and the sensing electrodes RE adjacent to each other in the firstdirection (x-axis direction) may be connected through second connectionpatterns BE2. In addition, in order to electrically separate the sensingelectrodes RE from the proximity sensing electrodes PE at theirintersections, the proximity sensing electrodes PE adjacent to eachother in the second direction (y-axis direction) may be connectedthrough third connection patterns BE3, and the sensing electrodes REadjacent to each other in the first direction (x-axis direction) may beconnected through the second connection patterns BE2.

The driving electrodes TE and the sensing electrodes RE may be disposedin both the first area PA1 and the second area PA2 of the touch sensingarea TSA. On the contrary, the proximity sensing electrodes PE may bedisposed only in the first area PA1 of the touch sensing area TSA.Therefore, in the first area PA1, first mutual capacitances C_(m1) maybe formed between the driving electrodes TE and the sensing electrodesRE, and second mutual capacitances may be formed between the drivingelectrodes TE and the proximity sensing electrodes PE.

The conductive patterns DE may be electrically separated from thedriving electrodes TE and the sensing electrodes RE. The drivingelectrodes TE, the sensing electrodes RE, and the conductive patterns DEmay be disposed apart from each other. In the first area PA1, theconductive patterns DE may be surrounded by the sensing electrodes RE,respectively. In the second area PA2, the conductive patterns DE may besurrounded by the driving electrodes TE and the sensing electrodes RE,respectively. The parasitic capacitance between the second electrode ofthe emission material layer EML and the driving electrode TE or thesensing electrode RE may be reduced due to the conductive patterns DE.When the parasitic capacitance is reduced, there is an advantage in thatthe mutual capacitance between the driving electrode TE and the sensingelectrode RE can be charged more quickly. However, as the area of thedriving electrode TE and the sensing electrode RE is reduced due to theconductive patterns DE, the mutual capacitance between the drivingelectrode TE and the sensing electrode RE may be reduced. As a result,they may be affected by noise. Therefore, it is desired to determine thearea of the conductive patterns DE by the trade-off between theparasitic capacitance and the mutual capacitance.

The touch lines TL, RL and PL may be disposed in the touch peripheralarea TPA. The touch lines TL and RL may include sensing lines RLconnected to the sensing electrodes RE, first driving lines TL1 andsecond driving lines TL2 connected to the driving electrodes TE, and aproximity sensing line PL connected to the proximity sensing electrodesPE.

The sensing electrodes RE disposed on one side of the touch sensing areaTSA may be connected to the sensing lines RL. For example, some of thesensing electrodes RE electrically connected in the first direction(x-axis direction) that are disposed at the right end may be connectedto the sensing lines RL as shown in FIG. 7. The sensing lines RL may beconnected to second touch pads TP2. Thus, the touch driving circuit 400may be electrically connected to the sensing electrodes RE.

The driving electrodes TE disposed on the one side of the touch sensingarea TSA may be connected to the first driving lines TL1, while thedriving electrodes TE disposed on the other side of the touch sensingarea TSA may be connected to the second driving lines TL2. For example,some of the driving electrodes TE electrically connected to one anotherin the second direction (y-axis direction) on the lowermost side may beconnected to the first driving line TL1, while some of the drivingelectrodes TE disposed on the uppermost side may be connected to thesecond driving line TL2. The second driving lines TL2 may be connectedto the driving electrodes TE on the upper side of the touch sensing areaTSA via the left outside of the touch sensing area TSA. The firstdriving lines TL1 and the second driving lines TL2 may be connected tothe first touch pads TP1. Thus, the touch driving circuit 400 may beelectrically connected to the driving electrodes TE.

The proximity sensing electrodes PE disposed on the other side of thetouch sensing area TSA may be connected to the proximity sensing linePL. For example, the uppermost one of the proximity sensing electrodesPE electrically connected with one another in the second direction(y-axis direction) may be connected to the proximity sensing line PL.The proximity sensing line PL may be extended along the left outside ofthe touch sensing area TSA to be connected to the proximity sensingelectrodes PE on the upper side of the touch sensing area TSA. Theproximity sensing line PL may be connected to first touch pads TP1.Thus, the touch driving circuit 400 may be electrically connected to theproximity sensing electrodes PE.

The display device 10 may detect whether a person or an object isproximate to the touch detecting unit TDU by sensing the amount ofchange in the second mutual capacitance between the driving electrodesTE and the proximity sensing electrodes PE. Proximity sensing should beable to detect the presence of a person or an object without anyphysical contact with the touch detecting unit TDU. Therefore, it isdesired that the magnitude of the mutual capacitance for detectingproximity of a person or an object is larger than the magnitude of themutual capacitance for detecting a touch of a person or an object. Sincethe magnitude of the second mutual capacitance is proportional to themagnitude of the driving electrode TE and the magnitude of the proximitysensing electrode PE, in order to increase the magnitude of the secondmutual capacitance, the proximity sensing electrodes PE may beelectrically connected to the single proximity sensing line PL as shownin FIG. 7.

The first guard line GL1 may be disposed on the outside of the outermostone of the sensing lines RL. In addition, the first ground line GRL1 maybe disposed on the outside of the first guard line GL1. As shown in FIG.7, the first guard line GL1 may be disposed on the right side of therightmost one of the sensing lines RL, and the first ground line GRL1may be disposed on the right side of the first guard line GL1.

A second guard line GL2 may be disposed between the innermost one of thesensing lines RL and the rightmost one of the first driving lines TL1.As shown in FIG. 7, the innermost one of the sensing lines RL may be theleftmost one of the sensing lines RL. The second guard line GL2 may bedisposed between the rightmost one of the first driving lines TL1 andthe second ground line GRL2.

A third guard line GL3 may be disposed between the innermost one of thesensing lines RL and the second ground line GRL2. The second ground lineGRL2 may be connected to the rightmost one of the first touch pads TP1and the leftmost one of the second touch pads TP2.

A fourth guard line GL4 may be disposed on the outside of the outermostone of the second driving lines TL2. As shown in FIG. 7, the fourthguard line GL4 may be disposed on the left side of the leftmost one ofthe second driving lines TL2.

In addition, the third ground line GRL3 may be disposed on the outsideof the fourth guard line GL4. As shown in FIG. 7, the fourth guard lineGL4 may be disposed on the left side and upper side of the leftmost anduppermost one of the second driving lines TL2, and the third ground lineGRL3 may be disposed on the left side and upper side of the fourth guardline GL4.

A fifth guard line GL5 may be disposed on the inside of the innermostone of the second driving lines TL2. As shown in FIG. 7, the fifth guardline GL5 may be disposed between the rightmost one of the second drivinglines TL2 and the sensing electrodes RE.

A ground voltage may be applied to the first ground line GRL1, thesecond ground line GRL2 and the third ground line GRL3. In addition, aground voltage may be applied to the first guard line GL1, the secondguard line GL2, the third guard line GL3, the fourth guard line GL4 andthe fifth guard line GL5.

According to the example embodiment shown in FIG. 7, the drivingelectrodes TE and the sensing electrodes RE may be disposed in both thefirst area PA1 and the second area PA2 of the touch sensing area TSA,and the proximity sensing electrodes PE may be disposed only in thefirst area PA1 of the touch sensing area TSA. Therefore, in the firstarea PA1, first mutual capacitances C_(m1) may be formed between thedriving electrodes TE and the sensing electrodes RE, and second mutualcapacitances may be formed between the driving electrodes TE and theproximity sensing electrodes PE. As a result, touch sensing as well asproximity sensing can be performed simultaneously. On the other hand, inthe second area PA2, since only the first mutual capacitances C_(m1) areformed between the driving electrodes TE and the sensing electrodes RE,only touch sensing can be performed.

According to the example embodiment of the present disclosure shown inFIG. 7, the first ground line GRL1, the second ground line GRL2, and thethird ground line GRL3 are disposed on the uppermost side, the leftmostside, and the rightmost side of the display panel 100, respectively. Inaddition, ground voltage is applied to the first ground line GRL1, thesecond ground line GRL2 and the third ground line GRL3. Accordingly,when static electricity is applied from the outside, the staticelectricity can be discharged to the first ground line GRL1, the secondground line GRL2, and the third ground line GRL3.

In addition, according to the example embodiment of the presentdisclosure shown in FIG. 7, the first guard line GL1 is disposed betweenthe outermost one of the sensing lines RL and the first ground lineGRL1, so that it can reduce the influence on the outermost one of thesensing lines RL by a change in the voltage of the first ground lineGRL1. The second guard line GL2 is disposed between the innermost one ofthe sensing lines RL and the outermost one of the first driving lineTL1. Therefore, the second guard line GL2 can reduce the influence by achange in the voltage on the innermost one of the sensing lines RL andon the outermost one of the first driving lines TL1 by a change in thevoltage. The third guard line GL3 is disposed between the innermost oneof the sensing lines RL and the second ground line GRL2, so that it canreduce the influence on the innermost one of the sensing lines RL by achange in the voltage of the second ground line GRL2. The fourth guardline GL4 is disposed between the outermost one of the second sensinglines TL2 and the third ground line GRL3, so that it can reduce theinfluence on the second driving line TL2 by a change in the voltage ofthe third ground line GRL3. The fifth guard line GL5 is disposed betweenthe innermost one of the second driving lines TL2 and the touchelectrodes TE and RE, so that it can suppress the innermost one of thesecond driving lines TL2 and the touch electrodes TE and RE frominfluencing mutually.

FIG. 8 is a view showing an example of a method for detecting the amountof change in a first mutual capacitance and the amount of change in asecond mutual capacitance in the first area of FIG. 7. FIG. 9 is a viewshowing an example of a method for detecting the amount of change in afirst mutual capacitance in the second area of FIG. 7.

For convenience of illustration, FIGS. 8 and 9 shows only drivingelectrodes TE arranged in a row and electrically connected to each otherin the second direction (y-axis direction), and sensing electrodes REarranged in a row and electrically connected to each other in the firstdirection (x-axis direction).

Referring to FIGS. 8 and 9, in the first area PA1, a first mutualcapacitance C_(m1) may be formed between the driving electrode TE andthe sensing electrode RE, and a second mutual capacitance C_(m2) may beformed between the driving electrode TE and the proximity sensingelectrode PE. In the second area PA2, the first mutual capacitanceC_(m1) may be formed between the driving electrode TE and the sensingelectrode RE.

The touch driving circuit 400 may include a touch driving signal output410, a first touch detector 420, a first analog-to-digital converter430, a second touch detector 440, and a second analog-to-digitalconverter 450.

The touch driving signal output 410 may output a touch driving signal TDto the driving electrodes TE through the first driving line TL1, and thetouch driving signal TD to the driving electrodes TE through the seconddriving line TL2. The touch driving signal TD may include a plurality ofpulses.

The touch driving signal output 410 may output the touch driving signalTD to the driving lines TL1 and TL2 in a predetermined order. Forexample, the touch driving signal output 410 may output the touchdriving signal TD sequentially from the driving electrodes TE disposedon the left side of the touch sensing area TSA of FIG. 7 to the drivingelectrodes TE disposed on the right side of the touch sensing area TSA.

The first touch detector 420 detects the voltage charged in the firstmutual capacitance C_(m1) through the sensing line RL electricallyconnected to the sensing electrodes RE. The first touch detector 420 mayinclude a first operational amplifier OA1, a first feedback capacitorC_(fb1), and a first reset switch RSW1. The first operational amplifierOA1 may include a first input terminal (−), a second input terminal (+),and an output terminal (out). The first input terminal (−) of the firstoperational amplifier OA1 may be connected to the sensing line RL, theinitialization voltage V_(REF) may be supplied to the second inputterminal (+), and the output terminal (out) of the first operationalamplifier OA1 may be connected to a first storage capacitor Cs1. Thefirst storage capacitor Cs1 is connected between the output terminal(out) and the ground to store the output voltage V_(out1) of the firstoperational amplifier OA1. The first feedback capacitor C_(fb1) and thefirst reset switch RSW1 may be connected in parallel between the firstinput terminal (−) and the output terminal (out) of the firstoperational amplifier OA1. The first reset switch RSW1 controls theconnection of both ends of the first feedback capacitor C_(fb1). Whenthe first reset switch RSW1 is turned on so that both ends of the firstfeedback capacitor C_(fb1) are connected, the first feedback capacitorC_(fb1) may be reset.

The output voltage V_(out1) of the first operational amplifier OA1 maybe defined as in Equation 1 below:

$\begin{matrix}{{{Vout}\; 1} = \frac{{Cm}\; 1 \times {Vt}\; 1}{{Cfb}\; 1}} & \left\lbrack {{Equation}\mspace{14mu} 1} \right\rbrack\end{matrix}$

where V_(out1) denotes the output voltage of the first operationalamplifier OA1, C_(m1) denotes the first mutual capacitance, C_(fb1)denotes the capacitance of the first feedback capacitor, and V_(t1)denotes the voltage charged in the first mutual capacitance C_(m1).

The first analog-to-digital converter 430 may convert the output voltageV_(out1) stored in the first storage capacitor C_(s1) into first digitaldata and output the first digital data.

The second touch detector 440 detects the voltage charged in the secondmutual capacitance C_(m2) through the proximity sensing line PLconnected to the proximity sensing electrodes PE. The second touchdetector 440 may include a second operational amplifier OA2, a secondfeedback capacitor C_(fb2), and a second reset switch RSW2. The secondoperational amplifier OA2 may include a first input terminal (−), asecond input terminal (+), and an output terminal (out). The first inputterminal (−) of the second operational amplifier OA2 may be connected tothe proximity sensing line PL, the initialization voltage V_(REF) may besupplied to the second input terminal (+), and the output terminal (out)of the second operational amplifier OA2 may be connected to a secondstorage capacitor C_(s2). The second storage capacitor C_(s2) isconnected between the output terminal (out) and the ground to store theoutput voltage V_(out2) of the second operational amplifier OA2. Thesecond feedback capacitor C_(fb2) and the second reset switch RSW2 maybe connected in parallel between the first input terminal (−) and theoutput terminal (out) of the second operational amplifier OA2. Thesecond reset switch RSW2 controls the connection of both ends of thesecond feedback capacitor C_(fb2). When the second reset switch RSW2 isturned on such that both ends of the second feedback capacitor C_(fb2)are connected, the second feedback capacitor C_(fb2) may be reset.

The output voltage V_(out2) of the second operational amplifier OA2 maybe defined as in Equation 2 below:

$\begin{matrix}{{{Vout}\; 2} = \frac{{Cm}\; 2 \times {Vt}\; 2}{{Cfb}\; 2}} & \left\lbrack {{Equation}\mspace{14mu} 2} \right\rbrack\end{matrix}$where V_(out2) denotes the output voltage of the second operationalamplifier OA2, C_(m2) denotes the second mutual capacitance, C_(fb2)denotes the capacitance of the second feedback capacitor, and V_(t2)denotes the voltage charged in the second mutual capacitance C_(m2).

The second analog-to-digital converter 450 may convert the outputvoltage V_(out2) stored in the second storage capacitor C_(s2) intosecond digital data and output the second digital data.

The touch driving circuit 400 may be driven in a touch sensing mode (ora first mode) and a proximity sensing mode (or a second mode). In thetouch sensing mode, the touch driving circuit 400 may be driven todetect the amounts of change in the first mutual capacitances C_(m1) ofthe first area PA1 and the second area PA2. In the proximity sensingmode, the touch driving circuit 400 may be driven to detect the amountsof change in the first mutual capacitances C_(m1) and changes in thesecond mutual capacitances C_(m2) of the first area PA1.

For example, the touch driving signal output 410 may output the touchdriving signal TD to the driving electrodes TE through the driving linesTL1 and TL2 in the touch sensing mode. The first touch detector 420 maydetect a voltage charged in the first mutual capacitance C_(m1) throughthe sensing line RL electrically connected to the sensing electrodes REin the touch sensing mode. The first analog-to-digital converter 430 mayconvert the output voltage V_(out1) of the first touch detector 420stored in the first storage capacitor C_(s1) into first digital data inthe touch sensing mode. The touch driving circuit 400 may calculatetouch coordinates by analyzing the first digital data in the touchsensing mode. For example, the touch driving circuit 400 may calculatefirst digital data equal to or greater than a first threshold value asfirst touch data, and may calculate the coordinates of the first mutualcapacitance C_(m1) corresponding to the first touch data as touchcoordinates.

In addition, the touch driving signal output 410 may output the touchdriving signal TD to the driving electrodes TE through the driving linesTL1 and TL2 in the proximity sensing mode. The first touch detector 420may detect the voltage charged in the first mutual capacitance C_(m1)through the sensing line RL electrically connected to the sensingelectrodes RE in the proximity sensing mode. The first analog-to-digitalconverter 430 may convert the output voltage V_(out1) of the first touchdetector 420 stored in the first storage capacitor C_(s1) into firstdigital data in the proximity sensing mode. The second touch detector440 may sense a voltage charged in the second mutual capacitance C_(m2)through the proximity sensing line PL electrically connected to theproximity sensing electrodes PE in the proximity sensing mode. Thesecond analog-to-digital converter 450 may convert the output voltageV_(out2) of the second touch detector 440 stored in the second storagecapacitor C_(s2) into second digital data in the proximity sensing modeto output it. The touch driving circuit 400 may determine whether aperson or an object is proximate by analyzing the first digital data andthe second digital data in the proximity sensing mode. For example, inthe proximity sensing mode, the touch driving circuit 400 may determinethat a person or an object is proximate when the sum of the firstdigital data and the second digital data is greater than or equal to asecond threshold value.

In order to perform the proximity sensing, it is required to detect thepresence of a person or an object without any physical contact with thetouch detecting unit TDU. Therefore, it is desired that the magnitude ofthe mutual capacitance for detecting proximity of a person or an objectis larger than the magnitude of the mutual capacitance for sensing atouch of a person or an object. To this end, the voltage difference VDbetween the high voltage and the low voltage of the touch driving signalTD applied in the proximity sensing mode may be greater than the voltagedifference VD between the high voltage and the low voltage of the touchdriving signal TD applied in the touch sensing mode. Alternatively, theperiod during which the second touch detector 440 detects the voltagecharged in the second mutual capacitance C_(m2) through the proximitysensing line PL in the proximity sensing mode may be longer than theperiod during which the second touch detector 440 detects the voltagecharged in the second mutual capacitance C_(m2) through the proximitysensing line PL in the touch sensing mode.

According to the example embodiment shown in FIGS. 8 and 9, the touchdetecting unit TDU detects the amounts of change in the first mutualcapacitances and the amount of change in the second mutual capacitancein the first area PA1, thereby determining whether a person or an objectis proximate thereto. Therefore, the display device 10 can detectwhether a person or an object is proximate without a proximity sensor.Accordingly, it is possible to prevent reduce the bezel width of thedisplay device 10 where otherwise the proximity sensor is disposed. Thebezel refers to the non-display area NDA disposed around the displayarea DA where an image is displayed.

FIG. 10 is an enlarged plan view showing an example of area A of FIG. 7.

Referring to FIG. 10, the sensing electrodes RE may be arranged in thefirst direction (x-axis direction) and electrically connected to oneanother. The driving electrodes TE may be arranged in the seconddirection (y-axis direction) and may be electrically connected to oneanother. The proximity sensing electrodes PE are arranged in the seconddirection (y-axis direction) and may be electrically connected to oneanother.

The driving electrodes TE, the sensing electrodes RE, the proximitysensing electrodes PE, and the conductive patterns DE may beelectrically separated from each other. The driving electrodes TE, thesensing electrodes RE, the proximity sensing electrodes PE, and theconductive patterns DE may be spaced apart from each other. The drivingelectrodes TE and the proximity sensing electrodes PE may be arranged inparallel in the second direction (y-axis direction). The proximitysensing electrodes PE may be surrounded by the driving electrodes TE,respectively. The conductive patterns DE may be surrounded by thesensing electrodes RE, respectively.

As shown in FIG. 10, the driving electrodes TE and the sensingelectrodes RE may have substantially the same size. The proximitysensing electrodes PE and the conductive patterns DE may besubstantially the same size. The size of the driving electrodes TE maybe larger than that of the proximity sensing electrodes PE. The size ofthe driving electrodes TE may be larger than that of the conductivepatterns DE. The size of the sensing electrodes RE may be larger thanthat of the proximity sensing electrodes PE. The size of the sensingelectrodes RE may be larger than that of the conductive patterns DE.Although each of the driving electrodes TE, the sensing electrodes RE,the proximity sensing electrodes PE, and the conductive patterns DE hasa diamond shape when viewed from the top in the example shown in FIG.10, the shape of each of the driving electrodes TE, the sensingelectrodes RE, the proximity sensing electrodes PE, and the conductivepatterns DE is not limited thereto.

In order to electrically separate the sensing electrodes RE from thedriving electrodes TE at their intersections, the driving electrodes TEadjacent to each other in the second direction (y-axis direction) may beconnected through the first connection patterns BE1, and the sensingelectrodes RE adjacent to each other in the first direction (x-axisdirection) may be connected through second connection patterns BE2. Inaddition, in order to electrically separate the sensing electrodes REfrom the proximity sensing electrodes PE at their intersections, theproximity sensing electrodes PE adjacent to each other in the seconddirection (y-axis direction) may be connected through third connectionpatterns BE3, and the sensing electrodes RE adjacent to each other inthe first direction (x-axis direction) may be connected through thesecond connection patterns BE2.

The first connection pattern BE1 may be formed on a different layer fromthe driving electrodes TE and may be connected to the driving electrodesTE through the first contact holes CNT1. For example, the firstconnection pattern BE1 may be formed in the first layer, and the drivingelectrodes TE may be formed in the second layer shown in FIG. 14. Thesecond layer may be disposed on the first layer. The first layer isdefined as a layer disposed on the thin-film encapsulation layer TFEL.Therefore, the first layer may be covered by the first touch insulatinglayer TINS1. The second layer is defined as a layer disposed on thefirst touch insulating layer TINS1. Therefore, the second layer may becovered by the second touch insulating layer TINS2.

Each of the first connection patterns BE1 may be bent at least once. InFIG. 10, the first connection patterns BE1 are bent in the shape of “<”or “>”, but the shape of the first connection patterns BE1 is notlimited thereto. In addition, since the driving electrodes TE adjacentto each other in the second direction (y-axis direction) are connectedby the plurality of first connection patterns BE1, even if any of thefirst connection patterns BE1 is disconnected, the driving electrodes TEcan still be stably connected with each other. Although two adjacentones of the driving electrodes TE are connected by two first connectionpatterns BE1 in the example shown in FIG. 10, but the number of firstconnection patterns BE1 is not limited thereto.

The second connection pattern BE2 is formed on the same layer as thesensing electrodes RE and may have a shape extended from the sensingelectrodes RE. The sensing electrodes RE and the second connectionpattern BE2 may be formed of the same material. For example, the sensingelectrodes RE and the second connection pattern BE2 may be formed in thesecond layer.

As shown in FIG. 10, the third connection pattern BE3 may include a(3-1) connection pattern BE3-1, a (3-2) connection pattern BE3-2, and a(3-3) connection pattern BE3-3. Each of the (3-1) connection patternBE3-1 and the (3-2) connection pattern BE3-2 may be electricallyseparated from the driving electrode TE. Each of the (3-1) connectionpattern BE3-1 and the (3-2) connection pattern BE3-2 may be spaced apartfrom the driving electrode TE.

The (3-1) connection pattern BE3-1 may be connected to the proximitysensing electrode PE surrounded by one of the driving electrodes TEadjacent to each other in the second direction (y-axis direction). The(3-2) connection pattern BE3-2 may be connected to the proximity sensingelectrode PE surrounded by another one of the driving electrodes TEadjacent to each other in the second direction (y-axis direction).

Each of the (3-3) connection patterns BE3-3 may be connected to the(3-1) connection pattern BE3-1 and the (3-2) connection pattern BE3-2.The (3-3) connection patterns BE3-3 may be formed on a different layerfrom the (3-1) connection patterns BE3-1 and the (3-2) connectionpatterns BE3-2, and may be connected to the (3-1) connection patternBE3-1 and the (3-2) connection pattern BE3-2 through the third contactholes CNT3. For example, the (3-3) connection patterns BE3-3 may beformed in the first layer shown in FIG. 14, and the proximity sensingelectrodes PE, the (3-1) connection pattern BE3-1, and the (3-2)connection pattern BE3-2 may be formed in the second layer shown in FIG.14. The second layer may be disposed on the first layer.

Each of the (3-3) connection patterns BE3-3 may be bent at least once.As shown in FIG. 10, the (3-3) connection pattern BE3-3 may be bent morethan the first connection pattern BE1 is bent, but the presentdisclosure is not limited thereto. In FIG. 10, the (3-3) connectionpattern BE3-3 is bent three times, but the number of bending of the(3-3) connection pattern BE3-3 is not limited thereto. In addition,since the proximity sensing electrodes PE adjacent to each other in thesecond direction (y-axis direction) are connected by a plurality of the(3-3) connection patterns BE3-3, even if any of the (3-3) connectionpatterns BE3-3 is disconnected, the proximity sensing electrodes PE canstill be stably connected with each other. Although two adjacent ones ofthe proximity sensing electrodes PE are connected by two (3-3)connection patterns BE3-3 in the example shown in FIG. 10, but thenumber of the (3-3) connection patterns BE3-3 is not limited thereto.

According to the example embodiment shown in FIG. 10, the firstconnection patterns BE1 connecting the driving electrodes TE adjacent toone another in the second direction (y-axis direction) and the (3-3)connection patterns BE3-3 electrically connecting the driving electrodesTE adjacent to one another in the second direction (y-axis direction)may be formed in the first layer, whereas the driving electrodes TE, thesensing electrodes RE, the proximity sensing electrodes PE, the secondconnection pattern BE2, the (3-1) connection pattern BE3-1, and the(3-2) connection pattern BE3-2 may be formed in the second layerdifferent from the first layer. Therefore, the driving electrodes TE,the sensing electrodes RE, and the proximity sensing electrodes PE maybe electrically separated from each other at their intersections, thesensing electrodes RE may be electrically connected with one another inthe first direction (x-axis direction), and the driving electrodes TEand the proximity sensing electrodes PE may be electrically connectedwith each other in the second direction (y-axis direction).

FIG. 11 is an enlarged plan view showing an example of area B of FIG. 7.

Referring to FIG. 11, the second area PA2 is different from thestructure of the first area PA in that the proximity sensing electrodesPE are replaced with the conductive patterns DE and the third connectionpatterns BE for electrically connecting the proximity sensing electrodesPE with one another in the second direction (y-axis direction) areeliminated. Therefore, the driving electrodes TE, the sensing electrodesRE, the conductive patterns DE, the first connection patterns BE1, andthe second connection patterns BE2 shown in FIG. 11 are substantiallyidentical to those described above with reference to FIG. 10. Therefore,the driving electrodes TE, the sensing electrodes RE, the conductivepatterns DE, the first connection patterns BE1, and the secondconnection patterns BE2 shown in FIG. 11 will not be described again.FIGS. 12A and 12B are enlarged plan views showing areas A-1 and A-2 ofFIG. 10, respectively.

Referring to FIGS. 12A and 12B, the driving electrodes TE, the sensingelectrodes RE, the first connection patterns BE1, the second connectionpatterns BE2, the (3-1) connection patterns BE3-1, the (3-2) connectionpatterns BE3-2, and the (3-3) connection patterns BE3-3 may be formed ina mesh shape. The proximity sensing electrodes PE and the conductivepatterns DE may also be formed in a mesh shape. When the touch sensinglayer TSL including the driving electrodes TE, the sensing electrodesRE, and the proximity sensing electrodes PE is formed directly on thethin-film encapsulation layer TFEL as shown in FIG. 5, the distancebetween the second electrode of the emission material layer EML and eachof the driving electrodes TE, the sensing electrodes RE, and theproximity sensing electrodes PE of the touch sensing layer TSL becomesclose one another. Therefore, large parasitic capacitance may be formedbetween the second electrode of the emission material layer EML and eachof the driving electrodes TE, the sensing electrodes RE, and theproximity sensing electrodes PE of the touch sensing layer TSL. Sincethe parasitic capacitance is proportional to the overlapping areabetween the second electrode of the emission material layer EML and eachof the driving electrodes TE, the sensing electrodes RE, and theproximity sensing electrodes PE of the touch sensing layer TSL.Therefore, in order to reduce the parasitic capacitance, it is desiredthat each of the driving electrodes TE, the sensing electrodes RE, andthe proximity sensing electrodes PE may be formed in a mesh shape.

Since the driving electrodes TE, the sensing electrode RE, the proximitysensing electrodes PE, the conductive patterns DE, the second connectionpatterns BE2, the (3-1) connection patterns BE-1 and the (3-2)connection patterns BE3-2 are formed on the same layer, they may bespaced apart from each other. There may be gaps between the drivingelectrode TE and the sensing electrode RE, between the driving electrodeTE and the proximity sensing electrode PE, between the driving electrodeTE and the second connection pattern BE2, between the driving electrodeTE and the (3-1) connection pattern BE3-1, between the driving electrodeTE and the (3-2) connection pattern BE3-2, and between the sensingelectrode RE and the conductive pattern DE. For convenience ofillustration, the boundary between the driving electrode TE and thesensing electrode RE, the boundary between the driving electrode TE andthe second connection pattern BE2, the boundary between the drivingelectrode TE and the (3-1) connection pattern BE3-1, and the boundarybetween the sensing electrode RE and the second connection pattern BE2are indicated by dashed lines in FIGS. 12A and 12B.

The first connection patterns BE1 may be connected to the drivingelectrodes TE through the first contact holes CNT1, respectively. Oneend of each of the first connection patterns BE1 may be connected to oneof the driving electrodes TE adjacent to each other in the seconddirection (y-axis direction) through a (1-1) contact hole CNT1-1. Theother end of each of the first connection patterns BE1 may be connectedto another one of the driving electrodes TE adjacent to each other inthe second direction (y-axis direction) through a (1-2) contact holeCNT1-2. The first connection patterns BE1 may overlap the drivingelectrodes TE and the sensing electrode RE. Alternatively, the firstconnection pattern BE1 may overlap the second connection pattern BE2instead of the sensing electrode RE. Alternatively, the first connectionpattern BE1 may overlap the sensing electrode RE as well as the secondconnection pattern BE2. Since the first connection pattern BE1 is formedon a different layer from the driving electrodes TE, the sensingelectrodes RE, and the second connection pattern BE2, it is possible toprevent a short-circuit from being created in the sensing electrode REand/or the second connection pattern BE2 even though they overlap thesensing electrode RE and/or the second connection pattern BE2.

The second connection pattern BE2 may be disposed between the sensingelectrodes RE. The second connection pattern BE2 is formed on the samelayer as the sensing electrodes RE and may be extended from each of thesensing electrodes RE. Therefore, the second connection pattern BE2 maybe connected to the sensing electrodes RE without any additional contacthole.

The (3-1) connection pattern BE3-1 may be disposed between one of theproximity sensing electrodes PE adjacent to one another in the seconddirection (y-axis direction) and the (3-3) connection pattern BE3-3. The(3-1) connection pattern BE3-1 may be formed on the same layer as theproximity sensing electrode PE. Therefore, the (3-1) connection patternBE3-1 may be extended from one of the proximity sensing electrodes PEadjacent to one another in the second direction (y-axis direction). The(3-1) connection pattern BE3-1 may be connected to a plurality of (3-3)connection patterns BE3-3. The (3-1) connection pattern BE3-1 may beconnected to one end of the (3-3) connection pattern BE3-3 through a(3-1) contact hole CNT3-1.

The (3-2) connection pattern BE3-2 may be disposed between another oneof the proximity sensing electrodes PE adjacent to one another in thesecond direction (y-axis direction) and the (3-3) connection patternBE3-3. The (3-2) connection pattern BE3-2 may be formed on the samelayer as the proximity sensing electrode PE. Therefore, the (3-2)connection pattern BE3-2 may be extended from another one of theproximity sensing electrodes PE adjacent to one another in the seconddirection (y-axis direction). The (3-2) connection pattern BE3-2 may beconnected to a plurality of (3-3) connection patterns BE3-3. The (3-2)connection pattern BE3-2 may be connected to the other end of the (3-3)connection pattern BE3-3 through a (3-2) contact hole CNT3-2.

The (3-3) connection pattern BE3-3 may be connected to each of the (3-1)connection pattern BE3-1 and the (3-2) connection pattern BE3-2 throughthe third contact holes CNT3. One end of the (3-3) connection patternBE3-3 may be connected to the (3-1) connection pattern BE3-1 through the(3-1) contact hole CNT3-1. The other end of the (3-3) connection patternBE3-3 may be connected to the (3-2) connection pattern BE3-2 through the(3-2) contact hole CNT3-2. The (3-3) connection patterns BE3-3 mayoverlap the driving electrodes TE and the sensing electrode RE.Alternatively, the (3-3) connection pattern BE3-3 may overlap the secondconnection pattern BE2 instead of the sensing electrode RE.Alternatively, the (3-3) connection pattern BE3-3 may overlap thesensing electrode RE and the second connection pattern BE2. Since the(3-3) connection pattern BE3-3 is formed on a different layer from thedriving electrodes TE, the sensing electrodes RE and the secondconnection pattern BE2, it is possible to prevent a short-circuit frombeing created in the sensing electrode RE and/or the second connectionpattern BE2 even though they overlap the sensing electrode RE and/or thesecond connection pattern BE2.

Sub-pixels R, G and B may include a first sub-pixel R emitting a firstcolor, a second sub-pixel G emitting a second color, and a thirdsub-pixel B emitting a third color. Although the first sub-pixel R is ared sub-pixel, the second sub-pixel G is a green sub-pixel, and thethird sub-pixel B is a blue sub-pixel in the example shown in FIGS. 12Aand 12B, the present disclosure is not limited thereto. Although thefirst sub-pixel R, the second sub-pixel G, and the third sub-pixel Bhave a hexagonal shape when viewed from the top in the example shown inFIGS. 12A and 12B, the present disclosure is not limited thereto. Thefirst sub-pixel R, the second sub-pixel G, and the third sub-pixel B mayhave a polygonal shape other than a hexagon, or a circular or ellipticalshape when viewed from the top. In addition, the first sub-pixel R, thesecond sub-pixel G, and the third sub-pixel B all have substantially thesame size, in the example shown in FIGS. 12A and 12B, the sizes of thesub-pixels R, G and B are not limited thereto. For example, the thirdsub-pixel B may have the largest size while the second sub-pixel G mayhave the smallest size. Alternatively, the size of the first sub-pixel Rmay be substantially equal to the size of the third sub-pixel B, whilethe size of the second sub-pixel G may be smaller than the size of eachof the first sub-pixel R and the third sub-pixel B.

A pixel P refers to a group of sub-pixels capable of representinggrayscales. In the example shown in FIGS. 12A and 12B, a pixel Pincludes a first sub-pixel R, two second sub-pixels G, and a thirdsub-pixel B. It is, however, to be understood that the presentdisclosure is not limited thereto. For example, a pixel P may include afirst sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3.

Since the driving electrodes TE, the sensing electrodes RE, theproximity sensing electrodes PE, the conductive patterns DE, the firstconnection patterns BE1, the second connection patterns BE2, the (3-1)connection patterns BE3-1, the (3-2) connection patterns BE3-2, and the(3-3) connection patterns BE3-3 are formed in a mesh shape, thesub-pixels R, G and B may not overlap the driving electrodes TE, thesensing electrodes RE, the proximity sensing electrodes PE, theconductive patterns DE, the first connection patterns BE1, the secondconnection patterns BE2, the (3-1) connection patterns BE3-1, the (3-2)connection patterns BE3-2, and the (3-3) connection patterns BE3-3.Accordingly, it is possible to prevent the brightness of the lightemitted from the sub-pixels R, G and B from decreasing because the lightemitted from the sub-pixels R, G and B is blocked by the drivingelectrodes TE, the sensing electrodes RE, the proximity sensingelectrodes PE, the conductive patterns DE, the first connection patternsBE1, the second connection patterns BE2, the (3-1) connection patternsBE3-1, the (3-2) connection patterns BE3-2, and the (3-3) connectionpatterns BE3-3.

FIGS. 13A and 13B are enlarged plan views showing areas B-1 and B-2 ofFIG. 11, respectively.

Referring to FIGS. 13A and 13B, the second area PA2 is different fromthe structure of the first area PA in that the proximity sensingelectrodes PE are replaced with the conductive patterns DE, and thethird connection patterns BE for electrically connecting the proximitysensing electrodes PE with one another in the second direction (y-axisdirection) are eliminated. Therefore, the driving electrodes TE, thesensing electrodes RE, the first connection patterns BE1, and the secondconnection patterns BE2 shown in FIGS. 13A and 13B are substantiallyidentical to those described above with reference to FIGS. 12A and 12B.Therefore, the driving electrodes TE, the sensing electrodes RE, thefirst connection patterns BE1, and the second connection patterns BE2shown in FIGS. 13A and 13B will not be described again.

FIG. 14 is a cross-sectional view showing an example, taken along lineII-II′ of FIG. 12A. FIG. 14 shows the connection structure between thedriving electrode TE and the first connection pattern BE1

Referring to FIG. 14, a thin-film transistor layer TFTL is formed on thesubstrate SUB. The thin-film transistor layer TFTL includes thin-filmtransistors 120, a gate insulator 130, an interlayer dielectric layer140, a protective layer 150, and a planarization layer 160.

A buffer film BF may be formed on a surface of the substrate SUB. Thebuffer film BF may be formed on one surface of the substrate SUB inorder to protect the thin-film transistors 120 and organic emittinglayer 172 of the emission material layer EML from moisture that islikely to permeate through the substrate SUB. The buffer film BF may beformed of a plurality of inorganic layers stacked on one anotheralternately. For example, the buffer film BF may be made up of multiplelayers in which one or more inorganic layers of a silicon nitride layer,a silicon oxynitride layer, a silicon oxide layer, a titanium oxidelayer and an aluminum oxide layer are alternately stacked on oneanother. The buffer film BF may be eliminated.

The thin-film transistors 120 are disposed on the buffer film BF. Eachof the thin-film transistors 120 includes an active layer 121, a gateelectrode 122, a source electrode 123, and a drain electrode 124. InFIG. 14, the thin-film transistors 120 are implemented as top-gatetransistors in which the gate electrode 122 is located above the activelayer 121. It is, however, to be understood that the present disclosureis not limited thereto. That is to say, the thin-film transistors 120may be implemented as bottom-gate transistors in which the gateelectrode 122 is located below the active layer 121, or as double-gatetransistors in which the gate electrodes 122 are disposed above andbelow the active layer 121.

The active layer 121 is formed on the buffer film BF. The active layer121 may include polycrystalline silicon, single crystal silicon,low-temperature polycrystalline silicon, amorphous silicon, or an oxidesemiconductor. The oxide semiconductor may include, for example, abinary compound (ABx), a ternary compound (ABxCy) and a quaternarycompound (ABxCyDz) containing indium, zinc, gallium, tin, titanium,aluminum, hafnium (Hf), zirconium (Zr), magnesium (Mg), etc. Forexample, the active layer 121 may include an oxide including indium,tin, and titanium (ITZO) or an oxide including indium, gallium and tin(IGZO). A light-blocking layer for blocking external light incident onthe active layer 121 may be formed between the buffer film BF and theactive layer 121.

The gate insulator 130 may be formed on the active layer 121. The gateinsulator 130 may be formed of an inorganic layer, for example, asilicon nitride layer, a silicon oxynitride layer, a silicon oxidelayer, a titanium oxide layer, or an aluminum oxide layer. In FIG. 14,the gate insulator 130 is formed on the entire buffer film BFirrespectively of the gate electrode 122, but the present disclosure isnot limited thereto. For example, the gate insulator 130 may be formedonly over the gate electrode 122.

The gate electrodes 122 and gate lines may be formed on the gateinsulator 130. The gate electrodes 122 and the gate lines may be made upof a single layer or multiple layers of one of molybdenum (Mo), aluminum(Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium(Nd) and copper (Cu) or an alloy thereof.

The interlayer dielectric layer 140 may be formed over the gateelectrodes 122 and the gate lines. The interlayer dielectric layer 140may be formed of an inorganic layer, for example, a silicon nitridelayer, a silicon oxynitride layer, a silicon oxide layer, a titaniumoxide layer, or an aluminum oxide layer.

The source electrodes 123 and the drain electrodes 124 may be formed onthe interlayer dielectric layer 140. Each of the source electrodes 123and the drain electrodes 124 may be connected to the active layer 121through a contact hole penetrating through the gate insulator 130 andthe interlayer dielectric layer 140. The source electrode 123 and thedrain electrode 124 may be made up of a single layer or multiple layersof one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au),titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or an alloythereof.

The protective layer 150 may be formed on the source electrode 213 andthe drain electrode 124 in order to insulate the thin-film transistors120. The protective layer 150 may be formed of an inorganic layer, forexample, a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer.

The planarization layer 160 may be formed on the protective layer 150 toprovide a flat surface over the step differences of the thin-filmtransistors 120. The planarization layer 160 may be formed of an organiclayer such as an acryl resin, an epoxy resin, a phenolic resin, apolyamide resin and a polyimide resin.

The emission material layer EML is formed on the thin-film transistorlayer TFTL. The emission material layer EML includes light-emittingelements 170 and a bank layer 180.

The light-emitting elements 170 and the bank layer 180 are formed on theplanarization layer 160. Each of the light-emitting elements 170 mayinclude a first electrode 171, an organic emitting layer 172, and asecond electrode 173.

The first electrode 171 may be formed on the planarization layer 160.Although the first electrode 171 is connected to the drain electrode 124of the thin-film transistor 120 through the contact hole penetratingthrough the protective layer 150 and the planarization layer 160 in theexample shown in FIG. 14, the present disclosure is not limited thereto.The first electrode 171 may be connected to the source electrode 123 ofthe thin-film transistor 120 through the contact hole penetratingthrough the protective layer 150 and the planarization layer 160.

In the top-emission organic light-emitting diode that light exits fromthe organic emitting layer 172 toward the second electrode 173, thefirst electrode 171 may be made of a metal material having a highreflectivity such as a stack structure of aluminum and titanium(Ti/Al/Ti), a stack structure of aluminum and ITO (ITO/Al/ITO), an APCalloy and a stack structure of APC alloy and ITO (ITO/APC/ITO). The APCalloy is an alloy of silver (Ag), palladium (Pd) and copper (Cu).

In the bottom-emission organic light-emitting diode that light exitsfrom the organic emitting layer 172 toward the first electrode 173, thefirst electrode 171 may be formed of a transparent conductive material(TCP) such as ITO and IZO that can transmit light, or asemi-transmissive conductive material such as magnesium (Mg), silver(Ag) and an alloy of magnesium (Mg) and silver (Ag). In such case, whenthe first electrode 171 is made of a semi-transmissive metal material,the light extraction efficiency can be increased by using microcavities.

The bank layer 180 may be formed to separate the first electrode 171from one another on the planarization layer 250 in order to define thesub-pixels R, G, and B. The bank layer 180 may be formed to cover theedge of the first electrode 171. The bank 180 may be formed of anorganic layer such as an acryl resin, an epoxy resin, a phenolic resin,a polyamide resin and a polyimide resin.

In each of the sub-pixels R, G, and B, the first electrode 171, theorganic emitting layer 172, and the second electrode 173 are stacked onone another sequentially, so that holes from the first electrode 171 andelectrons from the second electrode 173 are combined with each other inthe organic emitting layer 172 to emit light. The second sub-pixel G andthe third sub-pixel B may be formed substantially the same as the firstsub-pixel R shown in FIG. 14.

The organic emitting layer 172 is formed on the first electrode 171 andthe bank 180. The organic emitting layer 172 may include an organicmaterial and emit light of a certain color. For example, the organicemitting layer 172 may include a hole transporting layer, an organicmaterial layer, and an electron transporting layer. In this instance,the organic emitting layer 172 of the red sub-pixel R may emit redlight, the organic emitting layer 172 of the green sub-pixel G may emitgreen light, and the organic emitting layer 172 of the blue sub-pixel Bmay emit blue light.

Alternatively, the organic emitting layers 172 of the sub-pixels R, G,and B may be formed as a single layer to emit white light, ultravioletlight, or blue light. In this instance, the red sub-pixel R may overlapa red color filter layer transmitting red light, the green sub-pixel Gmay overlap a green color filter layer transmitting green light, and theblue sub-pixel B may overlap a blue color filter layer transmitting bluelight. The red color filter layer, the green color filter layer and theblue color filter layer may be disposed on the thin-film encapsulationlayer TFEL. In addition, the red sub-pixel R may overlap a redwavelength conversion layer that converts ultraviolet light or bluelight into red light, the green sub-pixel G may overlap a greenwavelength conversion layer that converts ultraviolet light or bluelight into green light, and the blue sub-pixel B may overlap a bluewavelength conversion layer that converts ultraviolet light or bluelight into blue light. The red wavelength conversion layer, the greenwavelength conversion layer, and the blue wavelength conversion layermay be disposed on the thin-film encapsulation layer TFEL. For example,the red wavelength conversion layer may be disposed between thethin-film encapsulation layer TFEL and the red color filter layer, thegreen wavelength conversion layer may be disposed between the thin-filmencapsulation layer TFEL and the green color filter layer, and the bluewavelength conversion layer may be disposed between the thin-filmencapsulation layer TFEL and the blue color filter layer.

The second electrode 173 is formed on the organic emitting layer 172.The second electrode 173 may be formed to cover the organic emittinglayer 172. The second electrode 173 may be a common layer formed acrossthe pixels P. A capping layer may be formed on the second electrode 173.

In the top-emission organic light-emitting diode, the second electrode173 may be formed of a transparent conductive material (TCP) such as ITOand IZO that can transmit light, or a semi-transmissive conductivematerial such as magnesium (Mg), silver (Ag) and an alloy of magnesium(Mg) and silver (Ag). When the second electrode 173 is formed of atransflective metal material, the light extraction efficiency can beincreased by using microcavities.

In the bottom-emission organic light-emitting diode, the secondelectrode 173 may be made of a metal material having a high reflectivitysuch as a stack structure of aluminum and titanium (Ti/Al/Ti), a stackstructure of aluminum and ITO (ITO/Al/ITO), an APC alloy and a stackstructure of APC alloy and ITO (ITO/APC/ITO). The APC alloy is an alloyof silver (Ag), palladium (Pd) and copper (Cu).

The thin-film encapsulation layer TFFL is formed on the emissionmaterial layer EML. The thin-film encapsulation layer TFEL is disposedon the second electrode 173. The thin-film encapsulation layer TFEL mayinclude at least one inorganic layer to prevent oxygen or moisture frompermeating into the organic emitting layer 172 and the second electrode173. In addition, the thin-film encapsulation layer TFEL may include atleast one organic layer to protect the emission material layer EML fromparticles such as dust. For example, the thin-film encapsulation layerTFEL may include a first inorganic layer disposed on the secondelectrode 173, an organic layer disposed on the first inorganic layer,and a second inorganic layer disposed on the organic layer. The firstinorganic layer and the second inorganic layer may be formed of, but isnot limited to, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.The organic layer may be formed of, but is not limited to, an acrylresin, an epoxy resin, a phenolic resin, a polyamide resin and apolyimide resin.

The touch sensing layer TSL may be formed on the thin-film encapsulationlayer TFEL. A buffer layer may be further formed between the thin-filmencapsulation layer TFEL and the touch sensing layer TSL. As describedabove with reference to FIG. 5, the touch sensing layer TSL may includethe driving electrodes TE, the sensing electrodes RE, the proximitysensing electrodes PE, the conductive patterns DE, the first connectionpatterns BE1, the second connection patterns BE2, the third connectionpatterns BE3, the first driving lines TL1, the second driving lines TL2,the sensing lines RL, the proximity sensing line PL, the guard linesGL1, GL2, GL3, GL4 and GL5, and the ground lines GRL1, GRL2, GRL3 andGRL4. FIG. 14 shows only the driving electrode TE, the sensing electrodeRE, the first connection pattern BE1, the (3-1) connection pattern BE3-1and the (3-3) connection pattern BE3-3 of the third connection patternsBE3 of the touch sensing layer TSL.

On the thin-film encapsulation layer TFEL, the first layer including thefirst connection patterns BE1 and the (3-3) connection patterns BE3-3 isformed. The first layer may be made up of, but is not limited to, astack structure of aluminum and titanium (Ti/Al/Ti), a stack structureof aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stack structure ofAPC alloy and ITO (ITO/APC/ITO).

A first touch insulating layer TINS1 is formed on the first layer. Thefirst touch insulating layer TINS1 may be formed of an inorganic layer,for example, a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.Alternatively, the first touch insulating layer TINS1 may be formed ofan organic layer such as an acryl resin, an epoxy resin, a phenolicresin, a polyamide resin and a polyimide resin.

The second layer is formed on the first touch insulating layer TINS1.The second layer may include the driving electrodes TE, the sensingelectrodes RE, the proximity sensing electrodes PE, the conductivepatterns DE, the second connection patterns BE2, the (3-1) connectionpatterns BE3-1, the (3-2) connection patterns BE3-2, the first drivinglines TL1, the second driving lines TL2, the sensing lines RL, theproximity sensing line PL, the guard lines GL1, GL2, GL3, GL4, and GL5,and the ground lines GRL1, GRL2, GRL3, and GRL4. The second layer may bemade up of, but is not limited to, a stack structure of aluminum andtitanium (Ti/Al/Ti), a stack structure of aluminum and ITO (ITO/Al/ITO),an APC alloy and a stack structure of APC alloy and ITO (ITO/APC/ITO).

First contact holes CNT1 may be formed through the first touchinsulating layer TINS1, via which the first connection patterns BE1 areexposed. The driving electrodes TE may be connected to the firstconnection patterns BE1 through the first contact holes CNT1. Thirdcontact holes CNT3 may be formed through the first touch insulatinglayer TINS1, via which the (3-3) connection patterns BE3-3 are exposed.The (3-1) connection pattern BE3-1 and the (3-2) connection patternBE3-2 may be connected to the (3-3) connection pattern BE3-3 through thethird contact holes CNT3.

A second touch insulating layer TINS2 is formed on the second layer. Thesecond touch insulating layer TINS2 may provide a flat surface over thelevel difference created by the first layer and the second layer. Thesecond touch insulating layer TINS2 may be formed of an organic layersuch as an acryl resin, an epoxy resin, a phenolic resin, a polyamideresin and a polyimide resin.

According to the example embodiment shown in FIG. 14, the firstconnection patterns BE1 connecting the driving electrodes TE adjacent toone another in the second direction (y-axis direction) and the (3-3)connection patterns BE3-3 electrically connecting the driving electrodesTE adjacent to one another in the second direction (y-axis direction)may be formed in the first layer, whereas the driving electrodes TE, thesensing electrodes RE, the proximity sensing electrodes PE, the secondconnection pattern BE2, the (3-1) connection pattern BE3-1 and the (3-2)connection pattern BE3-2 may be formed in the second layer differentfrom the first layer. Therefore, the driving electrodes TE, the sensingelectrodes RE, and the proximity sensing electrodes PE may beelectrically separated from each other at their intersections, thesensing electrodes RE may be electrically connected with one another inthe first direction (x-axis direction), and the driving electrodes TE,and the proximity sensing electrodes PE may be electrically connectedwith each other in the second direction (y-axis direction).

FIG. 15 is an enlarged plan view showing an example of area A of FIG. 7.FIG. 16 is an enlarged plan view showing an example of area B of FIG. 7.FIGS. 17A and 17B are enlarged plan views showing areas A-1 and A-2 ofFIG. 15, respectively. FIGS. 18A and 18B are enlarged plan views showingareas B-1 and B-2 of FIG. 16, respectively.

The example embodiment shown in FIGS. 15 to 18B is different from theexample embodiment shown in FIGS. 10 to 13 in that the first connectionpattern BE1 is disposed on the same layer as the driving electrodes TEin the first area PA1 and the second area PA2 of the touch sensing areaTSA and the second connection pattern BE2 is disposed on a differentlayer from the sensing electrodes RE. The following description willfocus on the differences.

Referring to FIGS. 15 to 18B, since the driving electrodes TE, thesensing electrode RE, the proximity sensing electrodes PE, theconductive patterns DE, the first connection pattern BE1, the (3-1)connection pattern BE-1 and the (3-2) connection pattern BE3-2 areformed on the same layer, they may be spaced apart from each other.There may be gaps between the driving electrode TE and the sensingelectrode RE, between the driving electrode TE and the proximity sensingelectrode PE, between the sensing electrode RE and the first connectionpattern BE1, between the driving electrode TE and the (3-1) connectionpattern BE3-1, between the driving electrode TE and the (3-2) connectionpattern BE3-2, and between the sensing electrode RE and the conductivepattern DE. For convenience of illustration, the boundary between thedriving electrode TE and the sensing electrode RE, the boundary betweenthe driving electrode TE and the second connection pattern BE2, theboundary between the driving electrode TE and the (3-1) connectionpattern BE3-1, and the boundary between the sensing electrode RE and thesecond connection pattern BE2 are indicated by dashed lines in FIGS. 17Aand 17B. For convenience of illustration, the boundary between thedriving electrode TE and the sensing electrode RE, the boundary betweenthe driving electrode TE and the second connection pattern BE2, and theboundary between the sensing electrode RE and the second connectionpattern BE2 are indicated by dashed lines in FIGS. 18A and 18B.

The first connection pattern BE1 may be disposed between the drivingelectrodes TE. The first connection pattern BE1 is formed on the samelayer as the driving electrodes TE and may be extended from each of thedriving electrodes TE. For example, the driving electrodes TE and thefirst connection pattern BE1 may be formed in the second layer shown inFIG. 14. Therefore, the first connection pattern BE1 may be connected tothe driving electrodes TE without any additional contact hole.

The second connection pattern BE2 may be formed on a different layerfrom the sensing electrodes RE and may be connected to the sensingelectrodes RE through the second contact holes CNT2. The secondconnection patterns BE2 may be connected to the sensing electrodes REthrough the second contact holes CNT2, respectively. One end of each ofthe second connection patterns BE2 may be connected to one of thesensing electrodes RE adjacent to each other in the first direction(x-axis direction) through a (2-1) contact hole CNT2-1. The other end ofeach of the second connection patterns BE2 may be connected to anotherone of the sensing electrodes RE adjacent to each other in the firstdirection (x-axis direction) through a (2-2) contact hole CNT2-2. Thesecond connection pattern BE2 may overlap the driving electrodes TE andthe sensing electrode RE. Alternatively, the second connection patternBE2 may overlap the first connection pattern BE1 instead of the drivingelectrode TE. Alternatively, the second connection pattern BE2 mayoverlap the driving electrode TE as well as the first connection patternBE1. Since the second connection pattern BE2 is formed on a differentlayer from the driving electrodes TE, the sensing electrodes RE, and thefirst connection pattern BE1, it is possible to prevent a short-circuitfrom being created in the driving electrode TE and/or the firstconnection pattern BE1 even though the second connection pattern BE2overlaps the driving electrode TE and/or the first connection patternBE1. For example, the second connection pattern BE2 may be formed in thefirst layer shown in FIG. 14, and the sensing electrodes RE may beformed in the second layer shown in FIG. 14. The second layer may bedisposed on the first layer.

The third connection pattern BE3 may include a (3-1) connection patternBE3-1, a (3-2) connection pattern BE3-2, and a (3-3) connection patternBE3-3. Since the (3-1) connection pattern BE3-1, the (3-2) connectionpattern BE3-2, and the (3-3) connection pattern BE3-3 are substantiallyidentical to those described with reference to FIGS. 10 to 13,therefore, the redundant description is omitted.

According to the example embodiment shown in FIGS. 15 to 18B, the secondconnection patterns BE2 connecting the sensing electrodes RE adjacent toone another in the first direction (x-axis direction) and the (3-3)connection patterns BE3-3 electrically connecting the proximity sensingelectrodes PE adjacent to one another in the second direction (y-axisdirection) may be formed in the first layer, while the drivingelectrodes TE, the sensing electrodes RE, the proximity sensingelectrodes PE, the first connection pattern BE1, the (3-1) connectionpattern BE3-1, and the (3-2) connection pattern BE3-2 may be formed inthe second layer different from the first layer. Therefore, the drivingelectrodes TE, the sensing electrodes RE, and the proximity sensingelectrodes PE may be electrically separated from each other at theirintersections, the sensing electrodes RE may be electrically connectedwith one another in the first direction (x-axis direction), and thedriving electrodes TE and the proximity sensing electrodes PE may beelectrically connected with each other in the second direction (y-axisdirection).

FIG. 19 is an enlarged plan view showing an example of area A of FIG. 7.FIGS. 20A and 20B are enlarged plan views showing areas A-1 and A-2 ofFIG. 19, respectively.

The example embodiment shown in FIGS. 19 to 20B is different from theexample embodiment shown in FIGS. 15 to 18 in that the (3-3) connectionpattern BE3-3 is disposed on the same layer as the driving electrodes TEin the first area PAL The second area PA2 according to the exampleembodiment shown in FIGS. 19 to 20B is substantially identical to thesecond area PA2 according to the example embodiment shown in FIGS. 15 to18; and, therefore, the redundant description is omitted. The followingdescription focuses on the differences.

Referring to FIGS. 19 to 20B since the driving electrodes TE, thesensing electrode RE, the proximity sensing electrodes PE, theconductive patterns DE, the first connection pattern BE1, the (3-1)connection pattern BE-1, the (3-2) connection pattern BE3-2, and the(3-3) connection pattern BE3-3 are formed on the same layer, they may bespaced apart from each other. There may be gaps between the drivingelectrode TE and the sensing electrode RE, between the driving electrodeTE and the proximity sensing electrode PE, between the sensing electrodeRE and the first connection pattern BE1, between the driving electrodeTE and the (3-1) connection pattern BE3-1, between the driving electrodeTE and the (3-2) connection pattern BE3-2, between the driving electrodeTE and the (3-3) connection pattern BE3-3, and between the sensingelectrode RE and the conductive pattern DE. For convenience ofillustration, the boundary between the driving electrode TE and thesensing electrode RE, the boundary between the driving electrode TE andthe first connection pattern BE1, the boundary between the drivingelectrode TE and the (3-1) connection pattern BE3-1, the boundarybetween the sensing electrode RE and the first connection pattern BE1,the boundary between the first connection pattern BE1 and the (3-3)connection pattern BE3-3, and the boundary between the (3-1) connectionpattern BE3-1 and the (3-3) connection pattern BE3-3 are indicated bydashed lines in FIGS. 20A and 20B.

The third connection pattern BE3 may include a (3-1) connection patternBE3-1, a (3-2) connection pattern BE3-2, and a (3-3) connection patternBE3-3. Since the (3-1) connection pattern BE3-1 and the (3-2) connectionpattern BE3-2 are substantially identical to those described withreference to FIGS. 10 to 13, therefore, the redundant description isomitted.

The (3-3) connection pattern BE3-3 may be disposed between the (3-1)connection pattern BE3-1 and the (3-2) connection pattern BE3-2. The(3-3) connection pattern BE3-3 may be formed on the same layer as the(3-1) connection pattern BE3-1, the (3-2) connection pattern BE3-2, andthe proximity sensing electrodes PE. The (3-3) connection pattern BE3-3may be extended from each of the (3-1) connection pattern BE3-1 and the(3-2) connection pattern BE3-2. For example, the proximity sensingelectrodes PE, the (3-1) connection pattern BE3-1, the (3-2) connectionpattern BE3-2 and the (3-3) connection pattern BE3-3 may be formed inthe second layer shown in FIG. 14. Therefore, the (3-3) connectionpattern BE3-3 may be connected to the (3-1) connection pattern BE3-1 andthe (3-2) connection pattern BE3-2 without any additional contact hole.

According to the example embodiment shown in FIGS. 19 to 20B, the secondconnection patterns BE2 connecting the sensing electrodes RE adjacent toone another in the first direction (x-axis direction) may be formed inthe first layer, while the driving electrodes TE, the sensing electrodesRE, the proximity sensing electrodes PE, the first connection patternBE1, the (3-1) connection pattern BE3-1, the (3-2) connection patternBE3-2 and the (3-3) connection pattern BE3-3 may be formed in the secondlayer different from the first layer. Therefore, the driving electrodesTE, the sensing electrodes RE and the proximity sensing electrodes PEmay be electrically separated from each other at their intersections,the sensing electrodes RE may be electrically connected with one anotherin the first direction (x-axis direction), and the driving electrodes TEand the proximity sensing electrodes PE may be electrically connectedwith each other in the second direction (y-axis direction).

FIG. 21 is a plan view showing the touch detecting unit of FIG. 5 andthe related elements.

The example embodiment shown in FIG. 21 is different from the exampleembodiment shown in FIG. 7 in that the proximity sensing electrodes PEare arranged in the first direction (x-axis direction) and electricallyconnected with one another in the first area PA1, and the conductivepatterns DE are surrounded by the driving electrodes TE, respectively.The following description focuses on the differences.

Referring to FIG. 21, in the first area PA1, the proximity sensingelectrodes PE may be arranged in parallel in the first direction (x-axisdirection) and may be electrically connected with one another. Theproximity sensing electrodes PE may be surrounded by the sensingelectrodes RE, respectively. In order to electrically separate thedriving electrodes TE from the sensing electrodes PE at theirintersections, the proximity sensing electrodes PE adjacent to eachother in the first direction (x-axis direction) may be connected throughthe third connection patterns BE1, and the driving electrodes TEadjacent to each other in the second direction (y-axis direction) may beconnected through first connection patterns BE1. In the first area PA1,the conductive patterns DE may be surrounded by the sensing electrodesRE, respectively.

The proximity sensing electrodes PE disposed on one side, i.e., theright side of the touch sensing area TSA may be connected to theproximity sensing line PL. For example, the rightmost one of theproximity sensing electrodes PE electrically connected with one anotherin the first direction (x-axis direction) may be connected to theproximity sensing line PL. The proximity sensing line PL may beconnected to second touch pads TP2. Thus, the touch driving circuit 400may be electrically connected to the proximity sensing electrodes PE.

According to the example embodiment shown in FIG. 21, the drivingelectrodes TE and the sensing electrodes RE may be disposed in both thefirst area PA1 and the second area PA2 of the touch sensing area TSA,and the proximity sensing electrodes PE may be disposed only in thefirst area PA1 of the touch sensing area TSA. Therefore, in the firstarea PA1, first mutual capacitances may be formed between the drivingelectrodes TE and the sensing electrodes RE, and third mutualcapacitances may be formed between the driving electrodes TE and theproximity sensing electrodes PE, and thus touch sensing as well asproximity sensing can be performed. On the other hand, in the secondarea PA2, only the first mutual capacitances C_(m1) are formed betweenthe driving electrodes TE and the sensing electrodes RE, only touchsensing can be performed.

Since the method for detecting the amount of change in the first mutualcapacitance C_(m1) and the amount of change in the third mutualcapacitance C_(m3) in the first area PA1 is substantially identical tothat described above with reference to FIG. 8, therefore, the redundantdescription is omitted. In addition, since the method for detecting theamount of change in the first mutual capacitance C_(m1) in the secondarea PA2 according to the example embodiment shown in FIG. 21 issubstantially identical to that described above with reference to FIG.9, therefore, the redundant description is omitted.

FIG. 22 is an enlarged plan view showing an example of area A of FIG.21. FIG. 23 is an enlarged plan view showing an example of area B ofFIG. 21. FIGS. 24A and 24B are enlarged plan views showing areas A-1 andA-2 of FIG. 22, respectively. FIGS. 25A and 25B are enlarged plan viewsshowing areas B-1 and B-2 of FIG. 23, respectively.

The example embodiment shown in FIGS. 22 to 25B is different from theexample embodiment shown in FIGS. 10 to 13 in that the first connectionpattern BE1 is disposed on the same layer as the driving electrodes TEand the second connection pattern BE2 is disposed on a different layerfrom the sensing electrodes RE in the first area PA1 and the second areaPA2 of the touch sensing area TSA, and that the proximity sensingelectrodes PE are electrically connected with one another along thefirst direction (x-axis direction) through the third connection patternBE3 in the first area PAL The following description focuses on thedifferences.

Referring to FIGS. 22 to 25B, since the driving electrodes TE, thesensing electrode RE, the proximity sensing electrodes PE, theconductive patterns DE, the first connection pattern BE1, the (3-1)connection pattern BE-1, and the (3-2) connection pattern BE3-2 areformed on the same layer, they may be spaced apart from each other.There may be gaps between the driving electrode TE and the sensingelectrode RE, between the sensing electrode RE and the proximity sensingelectrode PE, between the driving electrode TE and the second connectionpattern BE2, between the sensing electrode RE and the (3-1) connectionpattern BE3-1, between the sensing electrode RE and the (3-2) connectionpattern BE3-2, and between the driving electrode TE and the conductivepattern DE. For convenience of illustration, the boundary between thedriving electrode TE and the sensing electrode RE, the boundary betweenthe driving electrode TE and the first connection pattern BE1, theboundary between the sensing electrode RE and the first connectionpattern BE1, the boundary between the sensing electrode RE and the (3-1)connection pattern BE3-1, and the boundary between the sensing electrodeRE and the (3-2) connection pattern BE3-2 are indicated by dashed linesin FIGS. 24A and 24B. For convenience of illustration, the boundarybetween the driving electrode TE and the sensing electrode RE, theboundary between the driving electrode TE and the first connectionpattern BE1, and the boundary between the sensing electrode RE and thefirst connection pattern BE1 are indicated by dashed lines in FIGS. 18Aand 18B.

The first connection pattern BE1 may be disposed between the drivingelectrodes TE. The first connection pattern BE1 is formed on the samelayer as the driving electrodes TE and may be extended from each of thedriving electrodes TE. For example, the driving electrodes TE and thefirst connection pattern BE1 may be formed in the second layer shown inFIG. 14. Therefore, the first connection pattern BE1 may be connected tothe driving electrodes TE without any additional contact hole.

The second connection pattern BE2 may be formed on a different layerfrom the sensing electrodes RE and may be connected to the sensingelectrodes RE through the second contact holes CNT2. The secondconnection patterns BE2 may be connected to the sensing electrodes REthrough the second contact holes CNT2, respectively. One end of each ofthe second connection patterns BE2 may be connected to one of thesensing electrodes RE adjacent to each other in the first direction(x-axis direction) through a (2-1) contact hole CNT2-1. The other end ofeach of the second connection patterns BE2 may be connected to anotherone of the sensing electrodes RE adjacent to each other in the firstdirection (x-axis direction) through a (2-2) contact hole CNT2-2. Thesecond connection pattern BE2 may overlap the driving electrodes TE andthe sensing electrode RE. Alternatively, the second connection patternBE2 may overlap the first connection pattern BE1 instead of the drivingelectrode TE. Alternatively, the second connection pattern BE2 mayoverlap the driving electrode TE as well as the first connection patternBE1. Since the second connection pattern BE2 is formed on a differentlayer from the driving electrodes TE, the sensing electrodes RE and thefirst connection pattern BE1, it is possible to prevent a short-circuitfrom being created in the driving electrode TE and/or the firstconnection pattern BE1 even though the second connection pattern BE2overlaps the driving electrode TE and/or the first connection patternBE1. For example, the second connection pattern BE2 may be formed in thefirst layer shown in FIG. 14, and the sensing electrodes RE may beformed in the second layer shown in FIG. 14. The second layer may bedisposed on the first layer.

The third connection pattern BE3 may include a (3-1) connection patternBE3-1, a (3-2) connection pattern BE3-2, and a (3-3) connection patternBE3-3.

Each of the (3-1) connection pattern BE3-1 and the (3-2) connectionpattern BE3-2 may be electrically separated from the sensing electrodeRE. Each of the (3-1) connection pattern BE3-1 and the (3-2) connectionpattern BE3-2 may be spaced apart from the sensing electrodes RE.

The (3-1) connection pattern BE3-1 may be connected to the proximitysensing electrode PE surrounded by one of the sensing electrodes REadjacent to each other in the first direction (x-axis direction). The(3-2) connection pattern BE3-2 may be connected to the proximity sensingelectrode PE surrounded by another one of the sensing electrodes REadjacent to each other in the first direction (x-axis direction).

Each of the (3-3) connection patterns BE3-3 may be connected to the(3-1) connection pattern BE3-1 and the (3-2) connection pattern BE3-2.The (3-3) connection patterns BE3-3 may be formed on a different layerfrom the (3-1) connection patterns BE3-1 and the (3-2) connectionpatterns BE3-2, and may be connected to the (3-1) connection patternBE3-1 and the (3-2) connection pattern BE3-2 through the third contactholes CNT3. For example, the (3-3) connection patterns BE3-3 may beformed in the first layer shown in FIG. 14, and the proximity sensingelectrodes PE, the (3-1) connection pattern BE3-1 and the (3-2)connection pattern BE3-2 may be formed in the second layer shown in FIG.14. The second layer may be disposed on the first layer.

Each of the (3-3) connection patterns BE3-3 may be bent at least once.As shown in FIG. 22, the (3-3) connection pattern BE3-3 may be bent morethan the first connection pattern BE1, but the present disclosure is notlimited thereto. In FIG. 22, the (3-3) connection pattern BE3-3 is bentthree times, but the number of bendings of the (3-3) connection patternBE3-3 is not limited thereto. In addition, since the proximity sensingelectrodes PE adjacent to each other in the first direction (x-axisdirection) are connected by a plurality of the (3-3) connection patternsBE3-3, even if any of the (3-3) connection patterns BE3-3 isdisconnected, the proximity sensing electrodes PE can still be stablyconnected with each other. Although two adjacent ones of the proximitysensing electrodes PE are connected by two (3-3) connection patternsBE3-3 in the example shown in FIG. 10, but the number of the (3-3)connection patterns BE3-3 is not limited thereto.

According to the embodiment shown in FIGS. 22 to 25B, the secondconnection patterns BE2 connecting the sensing electrodes RE adjacent toone another in the first direction (x-axis direction) and the (3-3)connection patterns BE3-3 electrically connecting the proximity sensingelectrodes PE adjacent to one another in the first direction (x-axisdirection) may be formed in the first layer, while the drivingelectrodes TE, the sensing electrodes RE, the proximity sensingelectrodes PE, the first connection pattern BE1, the (3-1) connectionpattern BE3-1 and the (3-2) connection pattern BE3-2 may be formed inthe second layer different from the first layer. Therefore, the drivingelectrodes TE, the sensing electrodes RE and the proximity sensingelectrodes PE may be electrically separated from each other at theirintersections, the sensing electrodes RE may be electrically connectedwith one another in the first direction (x-axis direction), and thedriving electrodes TE may be electrically connected with each other inthe second direction (y-axis direction).

FIG. 26 is an enlarged plan view showing an example of area A of FIG.21. FIG. 27 is an enlarged plan view showing an example of area B ofFIG. 21. FIGS. 28A and 28B are enlarged plan views showing areas A-1 andA-2 of FIG. 26, respectively. FIGS. 29A and 29B are enlarged plan viewsshowing areas B-1 and B-2 of FIG. 27, respectively.

The example embodiment shown in FIGS. 26 to 29B is different from theexample embodiment shown in FIGS. 22 to 25B in that the first connectionpattern BE1 is disposed on a different layer from the driving electrodesTE and the second connection pattern BE2 is disposed on the same layeras the sensing electrodes RE in the first area PA1 and the second areaPA2. The following description focuses on the differences.

Referring to FIGS. 26 to 29B, since the driving electrodes TE, thesensing electrode RE, the proximity sensing electrodes PE, theconductive patterns DE, the second connection pattern BE2, the (3-1)connection pattern BE-1, and the (3-2) connection pattern BE3-2 areformed on the same layer, they may be spaced apart from each other.There may be gaps between the driving electrode TE and the sensingelectrode RE, between the driving electrode TE and the proximity sensingelectrode PE, between the driving electrode TE and the second connectionpattern BE2, between the sensing electrode RE and the (3-1) connectionpattern BE3-1, between the sensing electrode RE and the (3-2) connectionpattern BE3-2, and between the driving electrode TE and the conductivepattern DE. For convenience of illustration, the boundary between thedriving electrode TE and the sensing electrode RE, the boundary betweenthe driving electrode TE and the second connection pattern BE2, theboundary between the sensing electrode RE and the second connectionpattern BE2, the boundary between the sensing electrode RE and the (3-1)connection pattern BE3-1, and the boundary between the sensing electrodeRE, and the (3-2) connection pattern BE3-2 are indicated by dashed linesin FIGS. 28A and 28B. For convenience of illustration, the boundarybetween the driving electrode TE and the sensing electrode RE, theboundary between the driving electrode TE and the second connectionpattern BE2, and the boundary between the sensing electrode RE and thesecond connection pattern BE2 are indicated by dashed lines in FIGS. 29Aand 29B.

The first connection pattern BE1 may be formed on a different layer fromthe driving electrodes TE and may be connected to the driving electrodesTE through the first contact holes CNT1. The first connection patternsBE1 may be connected to the driving electrodes TE through the firstcontact holes CNT1, respectively. One end of each of the firstconnection patterns BE1 may be connected to one of the drivingelectrodes TE adjacent to each other in the second direction (y-axisdirection) through a (1-1) contact hole CNT1-1. The other end of each ofthe first connection patterns BE1 may be connected to another one of thedriving electrodes TE adjacent to each other in the second direction(y-axis direction) through a (1-2) contact hole CNT1-2. The firstconnection patterns BE1 may overlap the driving electrodes TE and thesensing electrode RE. Alternatively, the first connection pattern BE1may overlap the second connection pattern BE2 instead of the sensingelectrode RE. Alternatively, the first connection pattern BE1 mayoverlap the sensing electrode RE as well as the second connectionpattern BE2. Since the first connection pattern BE1 is formed on adifferent layer from the driving electrodes TE, the sensing electrodesRE, and the second connection pattern BE2, it is possible to prevent ashort-circuit from being created in the sensing electrode RE and/or thesecond connection pattern BE2 even though the first connection patternBE1 overlaps the sensing electrode RE and/or the second connectionpattern BE2. For example, the first connection pattern BE1 may be formedin the first layer shown in FIG. 14, and the sensing electrodes RE maybe formed in the second layer shown in FIG. 14. The second layer may bedisposed on the first layer.

The second connection pattern BE2 may be disposed between the sensingelectrodes RE. The second connection pattern BE2 is formed on the samelayer as the sensing electrodes RE and may be extended from each of thesensing electrodes RE. For example, the sensing electrodes RE and thesecond connection pattern BE2 may be formed in the second layer shown inFIG. 14. Therefore, the second connection pattern BE2 may be connectedto the sensing electrodes RE without any additional contact hole.

According to the example embodiment shown in FIGS. 26 to 29B, the firstconnection patterns BE1 connecting the driving electrodes TE adjacent toone another in the second direction (y-axis direction) and the (3-3)connection patterns BE3-3 electrically connecting the proximity sensingelectrodes PE adjacent to one another in the first direction (x-axisdirection) may be formed in the first layer, while the drivingelectrodes TE, the sensing electrodes RE, the proximity sensingelectrodes PE, the second connection pattern BE2, the (3-1) connectionpattern BE3-1 and the (3-2) connection pattern BE3-2 may be formed inthe second layer different from the first layer. Therefore, the drivingelectrodes TE, the sensing electrodes RE and the proximity sensingelectrodes PE may be electrically separated from each other at theirintersections, the sensing electrodes RE may be electrically connectedwith one another in the first direction (x-axis direction), and thedriving electrodes TE may be electrically connected with each other inthe second direction (y-axis direction).

FIG. 30 is an enlarged plan view showing an example of area A of FIG. 7.FIGS. 31A and 31B are enlarged plan views showing areas A-1 and A-2 ofFIG. 30, respectively.

The example embodiment shown in FIGS. 30 to 31B is different from theexample embodiment shown in FIGS. 26 to 29B in that the (3-3) connectionpattern BE3-3 is disposed on the same layer as the sensing electrodes REin the first area PAL The second area PA2 according to the exampleembodiment shown in FIGS. 30 to 31B is substantially identical to thesecond area PA2 according to the example embodiment shown in FIGS. 26 to29; and, therefore, the redundant description is omitted. The followingdescription will focus on the differences.

Referring to FIGS. 30 to 31B, since the driving electrodes TE, thesensing electrode RE, the proximity sensing electrodes PE, theconductive patterns DE, the second connection pattern BE2, the (3-1)connection pattern BE-1, the (3-2) connection pattern BE3-2, and the(3-3) connection pattern BE3-3 are formed on the same layer, they may bespaced apart from each other. There may be gaps between the drivingelectrode TE and the sensing electrode RE, between the driving electrodeTE and the proximity sensing electrode PE, between the driving electrodeTE and the second connection pattern BE2, between the sensing electrodeRE and the (3-1) connection pattern BE3-1, between the sensing electrodeRE and the (3-2) connection pattern BE3-2, between the sensing electrodeRE and the (3-3) connection pattern BE3-3, and between the drivingelectrode TE and the conductive pattern DE. For convenience ofillustration, the boundary between the driving electrode TE and thesensing electrode RE, the boundary between the driving electrode TE andthe second connection pattern BE2, the boundary between the sensingelectrode RE and the second connection pattern BE2, the boundary betweenthe sensing electrode RE and the (3-1) connection pattern BE3-1, theboundary between the sensing electrode RE and the (3-2) connectionpattern BE3-2, the boundary between the second connection pattern BE2and the (3-3) connection pattern BE3-3, the boundary between the (3-1)connection pattern BE3-1 and the (3-3) connection pattern BE3-3, and theboundary between the (3-2) connection pattern BE3-2 and the (3-3)connection pattern BE3-3 are indicated by dashed lines in FIGS. 31A and31B.

The third connection pattern BE3 may include a (3-1) connection patternBE3-1, a (3-2) connection pattern BE3-2, and a (3-3) connection patternBE3-3. Since the (3-1) connection pattern BE3-1 and the (3-2) connectionpattern BE3-2 are substantially identical to those described withreference to FIGS. 26 to 29B, therefore, the redundant description isomitted.

The (3-3) connection pattern BE3-3 may be disposed between the (3-1)connection pattern BE3-1 and the (3-2) connection pattern BE3-2. The(3-3) connection pattern BE3-3 may be formed on the same layer as the(3-1) connection pattern BE3-1, the (3-2) connection pattern BE3-2 andthe proximity sensing electrodes PE. The (3-3) connection pattern BE3-3may be extended from each of the (3-1) connection pattern BE3-1 and the(3-2) connection pattern BE3-2. For example, the proximity sensingelectrodes PE, the (3-1) connection pattern BE3-1, the (3-2) connectionpattern BE3-2, and the (3-3) connection pattern BE3-3 may be formed inthe second layer shown in FIG. 14. Therefore, the (3-3) connectionpattern BE3-3 may be connected to the (3-1) connection pattern BE3-1 andthe (3-2) connection pattern BE3-2 without any additional contact hole.

According to the example embodiment shown in FIGS. 19 and 20, the secondconnection patterns BE2 connecting the sensing electrodes RE adjacent toone another in the second direction (y-axis direction) may be formed inthe first layer, while the driving electrodes TE, the sensing electrodesRE, the proximity sensing electrodes PE, the second connection patternBE2, the (3-1) connection pattern BE3-1, the (3-2) connection patternBE3-2, and the (3-3) connection pattern BE3-3 may be formed in thesecond layer different from the first layer. Therefore, the drivingelectrodes TE, the sensing electrodes RE, and the proximity sensingelectrodes PE may be electrically separated from each other at theirintersections, the sensing electrodes RE may be electrically connectedwith one another in the first direction (x-axis direction), and thedriving electrodes TE and the proximity sensing electrodes PE may beelectrically connected with each other in the second direction (y-axisdirection).

FIG. 32 is a plan view showing the touch detecting unit of FIG. 5 andthe related elements.

The example embodiment shown in FIG. 32 is different from the exampleembodiment shown in FIG. 7 in that first proximity sensing electrodesPE1 are arranged in the second direction (y-axis direction) andelectrically connected with one another, and second proximity sensingelectrodes PE2 are arranged in the first direction (x-axis direction)and electrically connected with one another in the first area PAL Thefollowing description focuses on the differences.

Referring to FIG. 32, in the first area PA1, the first proximity sensingelectrodes PE1 may be arranged in parallel in the second direction(y-axis direction) and may be electrically connected with one another.The first proximity sensing electrodes PE1 may be surrounded by thedriving electrodes TE, respectively. In order to electrically separatethe sensing electrodes RE from the first proximity sensing electrodesPE1 at their intersections, the first proximity sensing electrodes PE1adjacent to each other in the second direction (y-axis direction) may beconnected through third connection patterns BE3, and the sensingelectrodes RE adjacent to each other in the first direction (x-axisdirection) may be connected through the second connection patterns BE2.

The second proximity sensing electrodes PE2 may be arranged in parallelin the first direction (x-axis direction) and electrically connected toone another. The second proximity sensing electrodes PE2 may besurrounded by the sensing electrodes RE, respectively. In order toelectrically separate the driving electrodes TE from the secondproximity sensing electrodes PE2 at their intersections, the secondproximity sensing electrodes PE2 adjacent to each other in the firstdirection (x-axis direction) may be connected through a fourthconnection patterns BE4 (not shown in FIG. 32), and the drivingelectrodes TE adjacent to each other in the second direction (y-axisdirection) may be connected through first connection patterns BE1.

The first proximity sensing electrodes PE1 disposed on one side, e.g.,the upper side of the touch sensing area TSA may be connected to a firstproximity sensing line PL1. For example, the uppermost one of the firstproximity sensing electrodes PE1 electrically connected with one anotherin the second direction (y-axis direction) may be connected to the firstproximity sensing line PL1. The first proximity sensing line PL1 may beconnected to the first touch pads TP1. Therefore, the touch drivingcircuit 400 may be electrically connected to the first proximity sensingelectrodes PE1.

The second proximity sensing electrodes PE2 disposed on the other side,e.g., the right side of the touch sensing area TSA may be connected to asecond proximity sensing line PL2. For example, the rightmost one of thesecond proximity sensing electrodes PE2 electrically connected with oneanother in the first direction (x-axis direction) may be connected tothe second proximity sensing line PL2. The second proximity sensing linePL2 may be connected to the second touch pads TP2. Therefore, the touchdriving circuit 400 may be electrically connected to the secondproximity sensing electrodes PE2.

According to the example embodiment shown in FIG. 32, the drivingelectrodes TE and the sensing electrodes RE may be disposed in both thefirst area PA1 and the second area PA2 of the touch sensing area TSA,and the first proximity sensing electrodes PE1 and the second proximitysensing electrode PE2 may be disposed only in the first area PA1 of thetouch sensing area TSA. Therefore, in the first area PA1, first mutualcapacitances C_(m1) may be formed between the driving electrodes TE andthe sensing electrodes RE, a second mutual capacitance C_(m2) may beformed between the driving electrodes TE and the first proximity sensingelectrodes PE1, and a third mutual capacitance C_(m3) may be formedbetween the driving electrodes TE and the second proximity sensingelectrodes PE2, and thus touch sensing as well as proximity sensing canbe performed. In addition, in the second area PA2, only the first mutualcapacitances C_(m1) are formed between the driving electrodes TE and thesensing electrodes RE, only touch sensing can be performed.

On the other hand, proximity sensing should be able to detect thepresence of a person or an object without any physically contact withthe touch detecting unit TDU. Therefore, it is desired that themagnitude of the mutual capacitance for detecting proximity of a personor an object is larger than the magnitude of the mutual capacitance fordetecting a touch of a person or an object. According to the exampleembodiment shown in FIG. 32, the third mutual capacitance C_(m3) isincluded in addition to the second mutual capacitance C_(m2), and thusthe magnitude of the mutual capacitance can be increased for proximitysensing.

FIG. 33 shows an example of a method for detecting the amount of changein the first mutual capacitance C_(m1), and the amount of change in thesecond mutual capacitance C_(m2) and the amount of change in the thirdmutual capacitance C_(m3) in the first area of FIG. 32.

The example embodiment shown in FIG. 33 is different from the exampleembodiment shown in FIG. 8 in that the third mutual capacitance C_(m3)is further formed between the driving electrode TE and the secondproximity sensing electrode PE2, and a third touch detector 460 fordetecting the amount of change in the third mutual capacitance C_(m3),and a third analog-to-digital converter 470 are further included.

Referring to FIG. 33, the third touch detector 460 detects the voltagecharged in the third mutual capacitance C_(m3) through the secondproximity sensing line PL2 connected to the second proximity sensingelectrodes PE2. The third touch detector 460 may include a thirdoperational amplifier OA3, a third feedback capacitor C_(fb3), and athird reset switch RSW3. The third operational amplifier OA3 may includea first input terminal (−), a second input terminal (+), and an outputterminal (out). The first input terminal (−) of the third operationalamplifier OA3 may be connected to the second proximity sensing line PL2,the initialization voltage V_(REF) may be supplied to the second inputterminal (+), and the output terminal (out) may be connected to a thirdstorage capacitor C_(s3). The third storage capacitor C_(s3) isconnected between the output terminal (out) of the third operationalamplifier OA3 and the ground to store the output voltage V_(out3) of thethird operational amplifier OA3. The third feedback capacitor C_(fb3)and the third reset switch RSW3 may be connected in parallel between thefirst input terminal (−) and the output terminal (out) of the thirdoperational amplifier OA3. The third reset switch RSW3 controls theconnection of both ends of the third feedback capacitor C_(fb3). Whenthe third reset switch RSW3 is turned on such that both ends of thethird feedback capacitor C_(fb3) are connected, the third feedbackcapacitor C_(fb3) may be reset.

The output voltage V_(out3) of the third operational amplifier OA3 maybe defined as in Equation 3 below:

$\begin{matrix}{{{Vout}\; 3} = \frac{{Cm}\; 3 \times {Vt}\; 3}{{Cfb}\; 3}} & \left\lbrack {{Equation}\mspace{14mu} 3} \right\rbrack\end{matrix}$where V_(out3) denotes the output voltage of the third operationalamplifier OA3, C_(m3) denotes the third mutual capacitance, C_(fb3)denotes the capacitance of the third feedback capacitor, and V_(t3)denotes the voltage charged in the third mutual capacitance C_(m3).

The third analog-to-digital converter 470 may convert the output voltageV_(out3) stored in the third storage capacitor C_(s3) into third digitaldata and output the third digital data.

The touch driving circuit 400 may be driven in the touch sensing modeand the proximity sensing mode. In the touch sensing mode, the touchdriving circuit 400 may be driven to detect the amounts of change in thefirst mutual capacitances C_(m1) of the first area PA1 and the secondarea PA2. In the proximity sensing mode, the touch driving circuit 400may be driven to detect the amounts of change in the first mutualcapacitances C_(m1), the amounts of change in the second mutualcapacitances C_(m2), and the amounts of change in the third mutualcapacitances C_(m3).

Since the operation of the touch driving circuit 400 in the touchsensing mode is substantially identical to that described above withreference to FIGS. 8 and 9; and, therefore, the redundant description isomitted.

The touch driving signal output 410 may output the touch driving signalTD to the driving electrodes TE through the driving lines TL1 and TL2 inthe proximity sensing mode. The first touch detector 420 may detectvoltages charged in the first mutual capacitances C_(m1) through thesensing line RL electrically connected to the sensing electrodes RE inthe proximity sensing mode. The first analog-to-digital converter 430may convert the output voltage V_(out1) of the first touch detector 420stored in the first storage capacitor C_(s1) into first digital data inthe proximity sensing mode.

The second touch detector 440 may detect a voltage charged in the secondmutual capacitance C_(m2) through the first proximity sensing line PL1electrically connected to the first proximity sensing electrodes PE1 inthe proximity sensing mode. The second analog-to-digital converter 450may convert the output voltage V_(out2) of the second touch detector 440stored in the second storage capacitor C_(s2) into second digital datain the proximity sensing mode to output it.

The third touch detector 460 may detect a voltage charged in the secondmutual capacitance C_(m2) through the second proximity sensing line PL2electrically connected to the second proximity sensing electrodes PE2 inthe proximity sensing mode. The second analog-to-digital converter 470may convert the output voltage V_(out3) of the third touch detector 460stored in the third storage capacitor Cs3 into third digital data in theproximity sensing mode to output it.

The touch driving circuit 400 may determine whether a person or anobject is proximate by analyzing the first digital data, the seconddigital data and the third digital data in the proximity sensing mode.For example, in the proximity sensing mode, the touch driving circuit400 may determine that a person or an object is proximate when thesummation of the first digital data, the second digital data, and thethird digital data is greater than or equal to a second threshold value.

According to the example embodiment shown in FIG. 33, the touchdetecting unit TDU can determine whether a person or an object isproximate by detecting the amount of change in the first mutualcapacitances C_(m1), the amount of change in the second mutualcapacitance C_(m2), and the amount of change in the third mutualcapacitance C_(m3) in the first area PAL Therefore, the display device10 can detect whether a person or an object is proximate without aproximity sensor. Accordingly, it is possible to prevent reduce thebezel width of the display device 10 where otherwise the proximitysensor is disposed.

FIG. 34 is an enlarged plan view showing an example of area A of FIG.32. FIGS. 35A and 35B are enlarged plan views showing areas A-1 and A-2of FIG. 34, respectively.

The example embodiment shown in FIGS. 34 to 35B is different from theexample embodiment shown in FIGS. 10 to 13 in that the first connectionpattern BE1 is disposed on the same layer as the driving electrodes TE,and the second connection pattern BE2 is disposed on a different layerfrom the sensing electrodes RE in the first area PA1 and the second areaPA2. The example embodiment shown in FIGS. 34 to 35B is different fromthe example embodiment shown in FIGS. 10 to 13 in that a (3-3)connection pattern BE3-3 is disposed between a (3-1) connection patternBE3-1 and a (3-2) connection pattern BE3-2, a (4-1) connection patternBE4-1 and a (4-2) connection pattern BE4-2 are disposed on the samelayer as the sensing electrodes RE, and a (4-2) connection pattern BE4-2is disposed on a different layer from the sensing electrodes RE. Thefollowing description focuses on the differences.

Referring to FIGS. 34 to 35B, since driving electrodes TE, sensingelectrodes RE, first proximity sensing electrodes PE1, second proximitysensing electrodes PE2, the first connection pattern BE1, the (3-1)connection pattern BE3-1, the (3-2) connection pattern BE3-2, the (4-1)connection pattern BE4-1, and the (4-2) connection pattern BE4-2 areformed on the same layer, they may be spaced apart from each other.There may be gaps between the driving electrode TE and the sensingelectrode RE, between the driving electrode TE and the first proximitysensing electrode PE1, between the driving electrode TE and the secondproximity sensing electrode PE2, between the driving electrode TE andthe second connection pattern BE2, between the driving electrode TE andthe (3-1) connection pattern BE3-1, between the driving electrode TE andthe (3-2) connection pattern BE3-2, between the sensing electrode RE andthe (4-1) connection pattern BE4-1, and between the sensing electrode REand the (4-2) connection pattern BE4-2. For convenience of illustration,the boundary between the driving electrode TE and the sensing electrodeRE, the boundary between the driving electrode TE and the firstconnection pattern BE1, the boundary between the driving electrode TEand the (3-1) connection pattern BE3-1, the boundary between the sensingelectrode RE and the (3-2) connection pattern BE3-2, the boundarybetween the sensing electrode RE and the first connection pattern BE1,the boundary between the sensing electrode RE and the (4-1) connectionpattern BE4-1, and the boundary between the sensing electrode RE and the(4-2) connection pattern BE4-2 are indicated by dashed lines in FIGS.35A and 35B.

The first connection pattern BE1 may be disposed between the drivingelectrodes TE. The first connection pattern BE1 is formed on the samelayer as the driving electrodes TE and may be extended from each of thedriving electrodes TE. For example, the driving electrodes TE and thefirst connection pattern BE1 may be formed in the second layer shown inFIG. 14. Therefore, the first connection pattern BE1 may be connected tothe driving electrodes TE without any additional contact hole.

The second connection pattern BE2 may be formed on a different layerfrom the sensing electrodes RE and may be connected to the sensingelectrodes RE through the second contact holes CNT2. The secondconnection patterns BE2 may be connected to the sensing electrodes REthrough the second contact holes CNT2, respectively. One end of each ofthe second connection patterns BE2 may be connected to one of thesensing electrodes RE adjacent to each other in the first direction(x-axis direction) through a (2-1) contact hole CNT2-1. The other end ofeach of the second connection patterns BE2 may be connected to anotherone of the sensing electrodes RE adjacent to each other in the firstdirection (x-axis direction) through a (2-2) contact hole CNT2-2. Thesecond connection pattern BE2 may overlap the driving electrodes TE andthe sensing electrode RE. Alternatively, the second connection patternBE2 may overlap the first connection pattern BE1 instead of the drivingelectrode TE. Alternatively, the second connection pattern BE2 mayoverlap the driving electrode TE as well as the first connection patternBE1. Since the second connection pattern BE2 is formed on a differentlayer from the driving electrodes TE, the sensing electrodes RE, and thefirst connection pattern BE1, it is possible to prevent a short-circuitfrom being created in the driving electrode TE and/or the firstconnection pattern BE1 even though they overlap the driving electrode TEand/or the first connection pattern BE1. For example, the secondconnection pattern BE2 may be formed in the first layer shown in FIG.14, and the sensing electrodes RE may be formed in the second layershown in FIG. 14. The second layer may be disposed on the first layer.

The third connection pattern BE3 may include the (3-1) connectionpattern BE3-1, the (3-2) connection pattern BE3-2, and the (3-3)connection pattern BE3-3. Since the (3-1) connection pattern BE3-1, the(3-2) connection pattern BE3-2, and the (3-3) connection pattern BE3-3are substantially identical to those described with reference to FIGS.10 to 13 except that the (3-3) connection pattern BE3-3 is disposedbetween the (3-1) connection pattern BE3-1 and the (3-2) connectionpattern BE3-2, therefore, the redundant description is omitted.

The fourth connection pattern BE4 may include the (41) connectionpattern BE4-1, the (4-2) connection pattern BE4-2, and the (4-3)connection pattern BE4-3. Each of the (4-1) connection pattern BE4-1 andthe (4-2) connection pattern BE4-2 may be electrically separated fromthe sensing electrode RE. Each of the (4-1) connection pattern BE4-1 andthe (4-2) connection pattern BE4-2 may be spaced apart from the sensingelectrode RE. The (4-1) connection pattern BE4-1, the (4-2) connectionpattern BE4-2, and the (4-3) connection pattern BE4-3 may be formed in amesh shape.

The (4-1) connection pattern BE4-1 may be connected to the secondproximity sensing electrode PE2 surrounded by one of the sensingelectrodes RE adjacent to each other in the first direction (x-axisdirection). The (4-2) connection pattern BE4-2 may be connected to thesecond proximity sensing electrode PE2 surrounded by another of thesensing electrodes RE adjacent to each other in the first direction(x-axis direction).

The (4-1) connection pattern BE4-1 may be disposed between one of thesecond proximity sensing electrodes PE adjacent to each other in thefirst direction (x-axis direction) and the (4-3) connection patternBE4-3. The (4-1) connection pattern BE4-1 may be formed on the samelayer as the second proximity sensing electrode PE2. Therefore, the(4-1) connection pattern BE4-1 may be extended from one of the secondproximity sensing electrodes PE2 adjacent to one another in the firstdirection (x-axis direction). The (4-1) connection pattern BE4-1 may beconnected to one end of the (4-3) connection pattern BE4-3 through a(4-1) contact hole CNT4-1.

The (4-2) connection pattern BE4-2 may be disposed between another oneof the second proximity sensing electrodes PE adjacent to each other inthe first direction (x-axis direction) and the (4-3) connection patternBE4-3. The (4-2) connection pattern BE4-2 may be formed on the samelayer as the second proximity sensing electrode PE2. Therefore, the(4-2) connection pattern BE4-2 may be extended from another one of thesecond proximity sensing electrodes PE2 adjacent to one another in thefirst direction (x-axis direction). The (4-2) connection pattern BE4-2may be connected to the other end of the (4-3) connection pattern BE4-3through a (4-2) contact hole CNT4-2. The (4-2) connection pattern BE4-2may overlap the (3-3) connection pattern BE3-3. Since the (4-2)connection pattern BE4-2 is formed on a different layer from the (3-3)connection pattern BE3-3, it is possible to prevent a short-circuit frombeing created in the (3-3) connection pattern BE3-3 even though it the(4-2) connection pattern BE4-2 overlaps the (3-3) connection patternBE3-3.

Each of the (4-3) connection patterns BE4-3 may be connected to the(4-1) connection pattern BE4-1 and the (4-2) connection pattern BE4-2.The (4-3) connection patterns BE4-3 may be formed on a different layerfrom the (4-1) connection patterns BE4-1 and the (4-2) connectionpatterns BE4-2, and may be connected to the (4-1) connection patternBE4-1 and the (4-2) connection pattern BE4-2 through the fourth contactholes CNT4. For example, the (4-3) connection patterns BE4-3 may beformed in the first layer shown in FIG. 14, while the proximity sensingelectrodes PE, the (4-1) connection pattern BE4-1, and the (4-2)connection pattern BE4-2 may be formed in the second layer shown in FIG.14. The second layer may be disposed on the first layer. The (3-3)connection pattern BE3-3 may be bent at least once, while the (4-3)connection pattern BE4-3 may not be bent. The (4-3) connection patternsBE4-3 may be disposed between the (4-1) connection pattern BE4-1 and the(4-2) connection pattern BE4-2.

The (4-3) connection pattern BE4-3 may be connected to each of the (4-1)connection pattern BE4-1 and the (4-2) connection pattern BE4-2 throughthe fourth contact holes CNT4. One end of the (4-3) connection patternBE4-3 may be connected to the (4-1) connection pattern BE4-1 through the(4-1) contact hole CNT4-1. The other end of the (4-3) connection patternBE4-3 may be connected to the (4-2) connection pattern BE4-2 through the(4-2) contact hole CNT4-2. The (4-3) connection pattern BE4-3 mayoverlap the sensing electrodes RE and the first connection pattern BE1.Since the (4-3) connection pattern BE4-3 is formed on a different layerfrom the sensing electrodes RE and the first connection pattern BE1, itis possible to prevent a short-circuit from being created in the sensingelectrode RE and/or the first connection pattern BE1 even though the(4-3) connection pattern BE4-3 overlaps the sensing electrode RE and thefirst connection pattern BE1.

According to the embodiment shown in FIGS. 34 to 35B, the secondconnection patterns BE2 connecting the sensing electrodes RE adjacent toone another in the first direction (x-axis direction), the (3-3)connection patterns BE3-3 electrically connecting the first proximitysensing electrodes PE1 adjacent to one another in the second direction(y-axis direction), and the (4-3) connection pattern connecting thesecond proximity sensing electrodes PE2 adjacent to each other in thefirst direction may be formed in the first layer, while the drivingelectrodes TE, the sensing electrodes RE, the proximity sensingelectrodes PE, the first connection pattern BE1, the (3-1) connectionpattern BE3-1, the (3-2) connection pattern BE3-2, the (4-1) connectionpattern BE4-1, and the (4-2) connection pattern BE4-2 may be formed inthe second layer different from the first layer. Therefore, the drivingelectrodes TE, the sensing electrodes RE, and the proximity sensingelectrodes PE may be electrically separated from each other at theirintersections, the sensing electrodes RE and the second proximitysensing electrode PE2 may be electrically connected with one another inthe first direction (x-axis direction), and the driving electrodes TEand the first proximity sensing electrode PE1 may be electricallyconnected with each other in the second direction (y-axis direction).

The present disclosure should not be construed as being limited to theembodiments set forth herein. Rather, these embodiments are provided sothat this disclosure will be thorough and complete and will fully conveythe concept of the invention to those skilled in the art.

While the present disclosure has been particularly shown and describedwith reference to some embodiments thereof, it will be understood by oneof ordinary skill in the art that various changes in form and detail maybe made therein without departing from the spirit and scope of thepresent disclosure as defined by the following claims.

What is claimed is:
 1. A touch detecting unit comprising: first sensorelectrodes arranged in a first direction and electrically connected withone another; second sensor electrodes arranged in a second directioncrossing the first direction, and electrically connected with oneanother, the second sensor electrodes electrically separated from thefirst sensor electrodes; and third sensor electrodes electricallyseparated from the first sensor electrodes and the second sensorelectrodes; a first connection pattern connecting the first sensorelectrodes adjacent to each other in the first direction; a secondconnection pattern electrically separated from the first connectionpattern and connecting the second sensor electrodes adjacent to eachother in the second direction; and a third connection patternelectrically separated from the first connection pattern and the secondconnection pattern and connecting the third sensor electrodes adjacentto each other in the first direction, wherein amounts of change in firstcapacitances between the first sensor electrodes and the second sensorelectrodes are detected in a first mode, wherein amounts of change in asecond capacitances between the first sensor electrodes and the thirdsensor electrodes and the amounts of change in the first capacitancesare detected in a second mode, wherein the first sensor electrodes, thesecond sensor electrodes, and the third sensor electrodes are disposedon a same layer, and wherein the first connection pattern is connectedto two first sensor electrodes adjacent to each other among the firstsensor electrodes through first contact holes, the second connectionpattern is directly connected to two second sensor electrodes adjacentto each other among the second sensor electrodes, and the thirdconnection pattern is connected to two third sensor electrodes adjacentto each other among the third sensor electrodes through second contactholes.
 2. The touch detecting unit of claim 1, wherein the third sensorelectrodes are arranged in the first direction and electricallyconnected with one another.
 3. The touch detecting unit of claim 1,further comprising conductive patterns electrically separated from thefirst sensor electrodes and the second sensor electrodes.
 4. The touchdetecting unit of claim 3, wherein the third sensor electrodes aresurrounded by the first sensor electrodes, respectively, and theconductive patterns are surrounded by the second sensor electrodes,respectively.
 5. The touch detecting unit of claim 3, wherein the thirdsensor electrodes are surrounded by the first sensor electrodes,respectively, in a first area, and wherein the conductive patterns aresurrounded by the second sensor electrodes, respectively, in the firstarea, and the conductive patterns are surrounded by the first sensorelectrodes and the second sensor electrodes, respectively, in a secondarea around the first area.
 6. The touch detecting unit of claim 1,wherein the third connection pattern comprises: a first sub-connectionpattern connected to a third sensor electrode among the third sensorelectrodes surrounded by one of the first sensor electrodes adjacent toeach other in the first direction; a second sub-connection patternconnected to the third sensor electrode surrounded by another one of thefirst sensor electrodes adjacent to each other in the first direction;and a third sub-connection pattern disposed between the firstsub-connection pattern and the second sub-connection pattern.
 7. Thetouch detecting unit of claim 6, wherein the first sub-connectionpattern and the second sub-connection pattern are electrically separatedfrom the first sensor electrodes adjacent to each other in the firstdirection.
 8. The touch detecting unit of claim 6, wherein each of thefirst connection pattern and the third sub-connection pattern overlapsat least one of the second sensor electrodes adjacent to each other inthe second direction or the second connection pattern.
 9. The touchdetecting unit of claim 6, wherein the first connection pattern and thethird sub-connection pattern are disposed on a first layer, and whereinthe first sensor electrodes, the second sensor electrodes, the thirdsensor electrodes, the second connection pattern, the firstsub-connection pattern, and the second sub-connection pattern aredisposed on a second layer.